NGK INSULATORS, LTD. ("NGK") to showcase the EnerCera® Battery, an innovative power source which is expected to contribute to maintenance-free solutions for IoT devices.
TDK Corporation (TSE: 6762) announces the InvenSense TCE-11101, a miniaturized ultra- low power MEMS gas sensor platform for direct and accurate detection of CO2 in home, automotive, IoT, healthcare, and other applications. The TCE-11101 introduces new technology that expands TDK’s sensor leadership into new applications and solutions, as part of the new SmartEnviroTM family. Its small size and low power enable consumer and commercial devices of all form factors that do not need to be wall-powered. The TCE-11101 is housed in a 5 mm x 5 mm x 1 mm 28-pin LGA package and requires minimal external components to complete the design.
According to research consultancy Omdia* 1, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully positioned itself as the market leader for MEMS microphones.
With the cyber threat landscape constantly evolving, Ewon, a business unit within HMS Networks and the global leader in industrial remote connectivity, has partnered with NVISO, an expert in cybersecurity, to bring industrial cybersecurity to the next level.
STMicroelectronics’ 800V 8H Triacs operate at full rated current up to the maximum junction temperature of 150°C, allowing heatsinks in drives for AC loads to be up to 50% smaller to combine compact dimensions with high reliability.
Automotive supplier receives award for innovative overall approach consisting of matrix LED headlamps, electronics for light control, sensor technology and software.
In Q1 2021, the revolutionary new Zivid Two 3D camera will be available from STEMMER IMAGING. The Zivid Two is a natural successor to the industry-leading Zivid One+ range of cameras.
TDK Corporation (TSE: 6762) announces the release of Tronics AXO®315, a miniature high performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration.