Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.
Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a new eBook in collaboration with Amphenol Corporation, highlighting the many applications of the Industrial Internet of Things (IIoT) as well as the technical challenges in developing IIoT solutions.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 A up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is also tailored for commercial, construction and agricultural vehicles (CAV) as well as for uninterruptible power supply (UPS) inverters.
The STEVAL-NRG011TV board from STMicroelectronics helps designers quickly build 200W digital power supplies and adapters for LED and OLED televisions to exceed the toughest energy-efficiency and standby regulations.