18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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Digi-key News

Digi-Key Electronics Launches myLists Consolidated List Management System

Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has launched a consolidated list management system, myLists, to streamline customers' BOM Manager, Price and Availability (PANDA^®), and Favorites into one convenient solution. The tool also offers enhanced functionality and new features.

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18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK provides its stray-field robust 3D HAL^® position sensors now with integrated decoupling capacitors

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensor family HAC^® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications.

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18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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Samsung News

5G for all – LPDDR5 uMCP opening up next-generation smartphone

LPDDR5 uMCP is giving the performance boost needed as high and mid-range smartphones enter the 5G space.

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18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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APPLIED MATERIALS INC. News

APPLIED MATERIALS BREAKTHROUGH IN CHIP WIRING ENABLES LOGIC SCALING TO 3NM AND BEYOND

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

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18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

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Renesas News

Renesas Unlocks Personalized Air Quality Experiences With Ultra-Low Power ZMOD4510 Outdoor Air Quality Sensor Platform

Enhanced Platform Delivers Selective Ozone Detection, Miniature Sensor, and a IP67 Waterproof Package for Wearables, Smartphones, and Industrial Monitoring Devices.

Read more…

18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-18T00:00:00+00:00" | date "longDate" }}

Bihl + Wiedemann News

IO-LINK WITH BIHL+WIEDEMANN: EASY, FLEXIBLE & COST-EFFICIENT

Do you already use the manufacturer-independent IO-Link interface to connect sensors and actuators to the control system level? Bihl+Wiedemann IO-Link solutions are user-friendly and cost-saving at the same time. With ASi-5, it is possible to integrate any IO-Link device into ASi and to configure it with up to 32 bytes of process data.

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18 {{ "2021-06-18T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-18T00:00:00+00:00" | date "longDate" }}

E-Peas News

E-PEAS Introduces Versatile New Buck-Boost ICs for Highly Efficient Energy Harvesting from Solar & RF/Vibrational Sources

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

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17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Dxomark News

Improving Image Stabilization with Hexapod 6-Axis Motion Simulators for More Reliable Image Capturing for Industry, Research and Consumers

Taking sharp pictures despite fast changing lighting and ambient conditions, taking snapshots without blurring, recognizing traffic signs or road markings in driver assistance systems, or identifying dangerous situations in surveillance systems – all of this is possible today with the help of modern cameras. But how are the different criteria for still and video images of cameras reliably measured and evaluated? When testing the image stabilization technologies, for example, hexapods are used to simulate the movement the cameras are subjected to while taking pictures.

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17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Telit News

Telit and VAIO Strengthen Strategic Alliance with the Launch of the New VAIO Z Carbon Fiber Notebook Built for 5G

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Read more…

17 {{ "2021-06-17T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-17T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight’s Open RAN Test Solutions Selected by Auden to Validate Open Radio Access Network Solutions

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

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Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Digi-Key Electronics Launches myLists Consolidated List Management System

TDK provides its stray-field robust 3D HAL^® position sensors now with integrated decoupling capacitors

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensor family HAC^® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications.

5G for all – LPDDR5 uMCP opening up next-generation smartphone

LPDDR5 uMCP is giving the performance boost needed as high and mid-range smartphones enter the 5G space.

APPLIED MATERIALS BREAKTHROUGH IN CHIP WIRING ENABLES LOGIC SCALING TO 3NM AND BEYOND

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

Renesas Unlocks Personalized Air Quality Experiences With Ultra-Low Power ZMOD4510 Outdoor Air Quality Sensor Platform

Enhanced Platform Delivers Selective Ozone Detection, Miniature Sensor, and a IP67 Waterproof Package for Wearables, Smartphones, and Industrial Monitoring Devices.

IO-LINK WITH BIHL+WIEDEMANN: EASY, FLEXIBLE & COST-EFFICIENT

E-PEAS Introduces Versatile New Buck-Boost ICs for Highly Efficient Energy Harvesting from Solar & RF/Vibrational Sources

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

Improving Image Stabilization with Hexapod 6-Axis Motion Simulators for More Reliable Image Capturing for Industry, Research and Consumers

Telit and VAIO Strengthen Strategic Alliance with the Launch of the New VAIO Z Carbon Fiber Notebook Built for 5G

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Keysight’s Open RAN Test Solutions Selected by Auden to Validate Open Radio Access Network Solutions

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

International

Market Overview

Technical Articles

Case studies

TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensor family HAC® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications.

LPDDR5 uMCP is giving the performance boost needed as high and mid-range smartphones enter the 5G space.

Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.

Enhanced Platform Delivers Selective Ozone Detection, Miniature Sensor, and a IP67 Waterproof Package for Wearables, Smartphones, and Industrial Monitoring Devices.

Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.

World’s first* 3D-molded, full-carbon chassis VAIO® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.

Enables test house to deliver O-RAN conformance, interoperability and end-to-end verification services.

International

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensor family HAC^® 39xy*, which features integrated capacitors for stray-field robust position detection in automotive and industrial applications.

World’s first* 3D-molded, full-carbon chassis VAIO^® Z premium notebooks feature the Telit 5G FN98x module series for 5G connectivity.