09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

Cadence News

Cadence Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for N3 Collaboration

Cadence paper highlights how engineers can leverage the digital full flow and TSMC’s N3 process technology to advance hyperscale and mobile design.

Read more…

09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

Infineon News

StrongIRFET 2 power MOSFETs 80 V and 100 V: right-fit products for a broad range of applications

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched StrongIRFET 2 – the new generation of power MOSFET technology in 80 V and 100 V.

Read more…

09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

TTI News

TTI Announces the Appointment of Mike Morton to the Position of Chief Executive Officer

TTI, Inc., a leading specialty distributor of electronic components, today announced the appointment of Mike Morton to the position of Chief Executive Officer, effective immediately.

Read more…

09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC SMARC 2.1 MODULES WITH NXP I.MX 8M PLUS PROCESSOR

Low power flagship for embedded vision and AI.

Read more…

09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

ST News

Class-D Amplifier for High-Definition Automotive Audio from STMicroelectronics Adds Diagnostics for Safety Alerting

The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.

Read more…

09 {{ "2021-03-09T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-09T00:00:00+00:00" | date "longDate" }}

Molex News

Molex Unveils Results of Global ‘State of 5G’ Survey

Molex, a leading global connectivity and electronics solutions provider, released results of a global survey of decision makers from telecom carriers exploring the “state of 5G” and the significant transformational opportunities it presents, along with its impact on deployment progress, current delivery challenges and emerging business prospects.

Read more…

08 {{ "2021-03-08T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-08T00:00:00+00:00" | date "longDate" }}

ONSEMI News

ON Semiconductor Extends IoT Platform Support and Capabilities through Bosch IoT Suite

Bosch IoT Suite software offers a wide range of data and device management features and cloud services.

Read more…

08 {{ "2021-03-08T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-08T00:00:00+00:00" | date "longDate" }}

Comsol News

Announcing COMSOL Days 2021: 40+ Online Events on Multiphysics Simulation

COMSOL announces COMSOL Days 2021 with more than 40 online events planned on a range of engineering and science topics.

Read more…

08 {{ "2021-03-08T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-08T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon’s CoolGaN delivers ultimate efficiency and reliability to telecom power applications

The pace of digitalization is speeding up, not only because of the recent push to online collaboration due to the coronavirus pandemic.

Read more…

05 {{ "2021-03-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-03-05T00:00:00+00:00" | date "longDate" }}

FEV News

FEV Offers Unparalleled Capability for Environmental Tests with eDLP

High-voltage batteries, electronics, and other vehicle components are exposed to a variety of punishing environmental influences during their life cycle.

Read more…

Cadence paper highlights how engineers can leverage the digital full flow and TSMC’s N3 process technology to advance hyperscale and mobile design.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched StrongIRFET 2 – the new generation of power MOSFET technology in 80 V and 100 V.

TTI, Inc., a leading specialty distributor of electronic components, today announced the appointment of Mike Morton to the position of Chief Executive Officer, effective immediately.

Low power flagship for embedded vision and AI.

The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.

Bosch IoT Suite software offers a wide range of data and device management features and cloud services.

COMSOL announces COMSOL Days 2021 with more than 40 online events planned on a range of engineering and science topics.

The pace of digitalization is speeding up, not only because of the recent push to online collaboration due to the coronavirus pandemic.

High-voltage batteries, electronics, and other vehicle components are exposed to a variety of punishing environmental influences during their life cycle.

International