CONTA-CLIP expands its terminal block range featuring push-in connection for 2.5 mm² cross sections, adding the new PIKD three-level initiator terminals and multi-wire terminals.
AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies. Custom RF to mmWave IP developed with AWR software is now accessible across Cadence design platforms, delivering seamless solutions for wireless systems. Foundational advance in IC, package and PCB RF workflows accelerates design turnaround time to align with customers’ end-market delivery time schedules. Fully integrated FEA solver technologies deliver accurate multiphysics (EM and thermal) systems analysis with near-linear scalability and capacity
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today unveiled RivieraWaves UWB, an extremely power-efficient ultra-wideband (UWB) turnkey MAC and PHY platform intellectual property (IP) compliant with the IEEE 802.15.4z standard and in accordance with the FiRa consortium specifications.
MAX25405 next-generation optical sensor recognizes a variety of gestures in a quarter of the size and at 10x lower cost than camera-based time-of-flight systems in next-generation automotive, industrial and consumer applications.
The IoT (Internet of Things) building blocks from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) are becoming ever more powerful, energy-efficient, and smaller.
TechInsights announces that Dr. Jeongdong Choe will be presenting a webinar titled: Memory Technology Highlights from TechInsights 2021. Two broadcasts are scheduled for June 29th; the first at 6am UTC, and the second at 3pm UTC.