19
'21
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Infineon News
19
'21
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Toshiba News
Toshiba Announces 18TB MG09 Series Hard Disk Drives
3rd-generation 9-disk Helium-sealed design and innovations in energy-assisted recording help customers achieve new levels of storage density and power efficiency.
18
'21
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Swindonsilicon News
Swindon Silicon Systems at Embedded World 2021
Main Theme - Smart Sensors made smarter using custom ICs and SiPs.
18
'21
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Congatec News
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC
congatec to solve ruggedization challenges of edge server and client designs.
18
'21
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TDK News
TDK offers new snap-in aluminum electrolytic capacitors with outstanding ripple current capability
Aluminum electrolytic capacitors.
18
'21
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IAR Systems News
IAR Systems strengthens functional safety offering with extended standards coverage
In addition to previous certification according to IEC 61508, ISO 26262, IEC 62304, EN 50128 and EN 50657, the certified edition of IAR Embedded Workbench for Arm now covers IEC 60730, ISO 13849, IEC 62061, IEC 61511 and ISO 25119.
18
'21
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Adlinktech News
ADLINK Technology at Embedded World 2021: Edge AI Strategy and Next-Gen Modules
Market-leading edge AI platforms and GPU computing.
18
'21
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ONSEMI News
ON Semiconductor Announce New 650V Silicon Carbide MOSFETs
Superior switching and improved reliability deliver power density improvements in a variety of challenging applications.
18
'21
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Gradconn News
I-PEX® MHF® 4L LK and MHF® 5L options now available for GradConn Cable assemblies
GradConn expands its range of assemblies featuring MHF® options to include the secure MHF® 4L LK and MHF® 5L micro connectors for use on standard and Nautilus waterproof coaxial cable assemblies.
18
'21
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Rutronik News
