21
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Mouser News
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Fischerelektronik News
New SMT / THR male header "Mixed Technology" with a grid pattern of 2.54 mm
Connectors are increasingly exposed to high levels of vibration. With the new mixed technology male header company Fischer Elektronik has expanded its product range with a 2.54 mm grid pattern.
19
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Stratasys News
MakerBot Offers Three New ABS Composite Materials from Kimya for METHOD 3D Printers
Available through MakerBot LABS, these new materials offer advanced properties that are ideal for manufacturing applications.
19
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Real Time Systems News
RTS Hypervisor: Full support for INtime RTOS
TenAsys and Real-Time Systems team up to greatly improve secure system consolidation and determinism.
18
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Recabuk News
Back to basics on computer-on-modules
Infographic highlights key differences and benefits of COMs.
18
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ST News
STMicroelectronics Teams with Microsoft® to Boost Development of Smart, Connected Devices Leveraging STM32Cube Ecosystem
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has signed an agreement with Microsoft to simplify and accelerate the development of smart-appliance controllers and other Internet-of-Things (IoT) devices.
18
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Mouser News
Mouser Electronics Now Shipping ams TCS3430 Dev Kit for Tristimulus Color and ALS Sensor
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the TCS3430 evaluation kit from ams.
17
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CEA Leti News
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices
Gallium Nitride Seen as Highly Efficient Replacement for Silicon In Wide Range of Consumer and Industrial Uses.
17
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Cadence News
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications.
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