To accelerate G3-PLC Hybrid connectivity in smart-grid and IoT devices, STMicroelectronics has revealed a development ecosystem for its ST8500 programmable power-line communication (PLC) modem chipset.
Philip Harting, CEO of the HARTING Technology Group, was re-elected at the virtual general meeting of ZVEI’s “Electronic Components and Systems” (ECS) trade association. Philip Harting had already served as chairman of the trade association for three years, and will now be on board for another three-year tenure.
Anritsu Corporation is pleased to announce the availability of its new RF Regulatory Test System ME7803NR solution for regulatory compliance testing of 5G communications systems.
NASA’s Perseverance rover, launched in July 2020, is landing on Mars on February 18. The Perseverance is carrying several scientific instruments on board, including Finnish-made humidity and pressure instrumentation.
ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today launches the TMD2636, a fully integrated proximity sensor which occupies 30% less space than currently available solutions, and so delivers trans-formational added value to manufacturers of True Wireless Stereo (TWS) earbuds.
TDK Corporation (TSE: 6762) has developed the new MLJ-H1005 inductors for use in NFC* (near field communication). Mass production will begin in February 2021.
Further progressing its goal of making battery-less technology more commonplace, e-peas has gained another big win for its energy harvesting power management ICs (PMICs).