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Kontron News

COM-HPC - Higher performance for Computer-on-Modules

Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC:

Bender News

Residual current monitoring up to the final circuit

In modern electrical systems, extensive monitoring by a wide range of sensors is often required in order to detect incipient insulation deterioration at an early stage and thus ensure both safety and high availability.

Flir News

FLIR TG Series Wins World-Renowned iF Design Award

FLIR is honored to announce that the FLIR TG series of thermal tools has won an iF Design Award for outstanding product design.

ST News

Fully Integrated Wireless-Charging IC from STMicroelectronics Maximizes Power Transfer and Charging Efficiency with Low Bill of Materials

In the age of 5G communication with ever-increasing demand for more power and higher efficiency, STMicroelectronics’ STWLC68 product family provides the best solution for wireless-charging applications with industry-leading efficiency, highest power transfer, and safety.

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