08
'20
Written on
Mouser News
08
'20
Written on
TDK News
TDK extends ultrasonic ToF sensor platform for long-range up to 5m
TDK Corporation (TSE: 6762) announces the worldwide availability of the Chirp CH201 long-range ultra-low power integrated ultrasonic Time-of-Flight (ToF) range sensor platform.
08
'20
Written on
Telit News
Telit and Sequans Partner to Launch New CBRS Modules
New low-cost modules for LTE Cat 4 and 6 CBRS OnGo networks now available.
07
'20
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Hanwha News
WISENET7 CHIPSET AWARDED UL CAP CYBERSECURITY CERTIFICATION
Hanwha Techwin’s position as a global leader in video surveillance has been reaffirmed with the announcement that Wisenet7, the company’s next-generation proprietary camera chipset, has achieved UL Cybersecurity Assurance Program (UL CAP) certification.
07
'20
Written on
ST News
STMicroelectronics Raises Performance and Value for Smart, Connected Devices with Even Faster STM32H7 Microcontrollers
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed record-breaking STM32* microcontrollers (MCUs) with embedded Flash that bring high-end features such as rich graphics, AI, and state-of-the-art cyber-protection to cost-sensitive new products.
07
'20
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Tsubaki Kabelschlepp News
NEW CABLE CARRIER UNIFLEX ADVANCED 1775
Our successful cable carrier in new size – more height, more width – simply more space for medium and large cable packages.
07
'20
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Sigmatek News
ModularWide Panels go the Distance with HMI-Link
The ModularWide panel series from SIGMATEK now also provides remote solutions up to 100 m with an HMI-Link unit.
07
'20
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Renesas News
Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment.
07
'20
Written on
TDK News
TDK releases new stray-field robust 3D HAL® position sensor with SPC interface
TDK Corporation (TSE:6762) announces the portfolio expansion of the Micronas masterHAL® sensor family with the release of HAL 3970, a new stray-field robust 3D HAL® position sensor.
07
'20
Written on
Mouser News
