06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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APPLIED MATERIALS INC. News

APPLIED MATERIALS INTRODUCES MATERIALS ENGINEERING SOLUTIONS FOR DRAM SCALING

Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).

Read more…

06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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Intel News

New Intel Processors Accelerate 5G Network Transformation

Intel today launched its newest 3rd Gen Intel^® Xeon^® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market.

Read more…

06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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HELLA News

HELLA BRINGS LATEST 77GHZ RADAR TECHNOLOGY FOR PASSENGER CARS INTO SERIES PRODUCTION

With over 90 million 24GHz sensors, the internationally positioned automotive supplier HELLA is one of the world's largest suppliers of radar sensors.

Read more…

06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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Farnell News

Farnell stocks new Panasonic particulate matter laser sensor

Panasonic’s innovative optical sensor accurately detects particles as small as 0.3µm, improving surrounding air quality by the smart activation of air purification equipment.

Read more…

06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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MEDIAWORLD

NSK linear guides help ETEL bring speed and precision to semiconductor manufacturing

NH series linear guides from NSK are helping a manufacturer of motion platforms for semiconductor manufacturing to provide its customers with a solution that offers speed and precision beyond previous capabilities. Called TELICA, this technology-driven breakthrough from Switzerland-based ETEL S.A. - a specialist in the design and manufacture of motion systems for semiconductors - can benefit any application in this sector that requires a combination of high throughput and high accuracy.

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06 {{ "2021-05-06T00:00:00+00:00" | date "MMM" }} '21

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Infineon News

Infineon introduces CoolGaN IPS family for applications in the 30 to 500 W power range

Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics.

Read more…

05 {{ "2021-05-05T00:00:00+00:00" | date "MMM" }} '21

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IAR Systems News

IAR Systems enables scalable automotive development based on Infineon Traveo II including MCAL

IAR Embedded Workbench for Arm provides maximized performance, ensured code quality and functional safety for Infineon Traveo II family of MCUs.

Read more…

05 {{ "2021-05-05T00:00:00+00:00" | date "MMM" }} '21

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ONSEMI News

ON Semiconductor Announces New Generations of SUPERFET MOSFETs and SiC Diodes at PCIM Europe 2021

New products deliver higher efficiency for power applications.

Read more…

05 {{ "2021-05-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-05T00:00:00+00:00" | date "longDate" }}

Nexperia News

New Trench Schottky rectifiers from Nexperia increase efficiency for fast switching applications

AEC-Q101 approved devices up to 100 V and 20 A combine low switching losses and increased safe operating area.

Read more…

05 {{ "2021-05-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-05T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Announces the Expansion of Its Radiation-Hardened Arm Microcontroller (MCU) Family for Space Systems

Designers can benefit from another step in the Arm Cortex-M7-based system-on-chip (SoC) commercial off-the-shelf (COTS) to rad-hard scalable solutions with the addition of embedded analog capabilities.

Read more…

Technical Articles

Electronic Design: What Is a Process Design Kit?

Case studies

Surface-mount production lines for automotive electronics manufacturing

APPLIED MATERIALS INTRODUCES MATERIALS ENGINEERING SOLUTIONS FOR DRAM SCALING

Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).

New Intel Processors Accelerate 5G Network Transformation

Intel today launched its newest 3rd Gen Intel^® Xeon^® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market.

HELLA BRINGS LATEST 77GHZ RADAR TECHNOLOGY FOR PASSENGER CARS INTO SERIES PRODUCTION

With over 90 million 24GHz sensors, the internationally positioned automotive supplier HELLA is one of the world's largest suppliers of radar sensors.

Farnell stocks new Panasonic particulate matter laser sensor

Panasonic’s innovative optical sensor accurately detects particles as small as 0.3µm, improving surrounding air quality by the smart activation of air purification equipment.

NSK linear guides help ETEL bring speed and precision to semiconductor manufacturing

Infineon introduces CoolGaN IPS family for applications in the 30 to 500 W power range

Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics.

IAR Systems enables scalable automotive development based on Infineon Traveo II including MCAL

IAR Embedded Workbench for Arm provides maximized performance, ensured code quality and functional safety for Infineon Traveo II family of MCUs.

ON Semiconductor Announces New Generations of SUPERFET MOSFETs and SiC Diodes at PCIM Europe 2021

New products deliver higher efficiency for power applications.

New Trench Schottky rectifiers from Nexperia increase efficiency for fast switching applications

AEC-Q101 approved devices up to 100 V and 20 A combine low switching losses and increased safe operating area.

Microchip Announces the Expansion of Its Radiation-Hardened Arm Microcontroller (MCU) Family for Space Systems

Designers can benefit from another step in the Arm Cortex-M7-based system-on-chip (SoC) commercial off-the-shelf (COTS) to rad-hard scalable solutions with the addition of embedded analog capabilities.

International

Technical Articles

Case studies

Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).

Intel today launched its newest 3rd Gen Intel® Xeon® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market.

With over 90 million 24GHz sensors, the internationally positioned automotive supplier HELLA is one of the world's largest suppliers of radar sensors.

Panasonic’s innovative optical sensor accurately detects particles as small as 0.3µm, improving surrounding air quality by the smart activation of air purification equipment.

Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high switching frequency, starting a new era in power electronics.

IAR Embedded Workbench for Arm provides maximized performance, ensured code quality and functional safety for Infineon Traveo II family of MCUs.

New products deliver higher efficiency for power applications.

AEC-Q101 approved devices up to 100 V and 20 A combine low switching losses and increased safe operating area.

Designers can benefit from another step in the Arm Cortex-M7-based system-on-chip (SoC) commercial off-the-shelf (COTS) to rad-hard scalable solutions with the addition of embedded analog capabilities.

International

Intel today launched its newest 3rd Gen Intel^® Xeon^® Scalable processor (code-named “Ice Lake”), including new network-optimized “N-SKUs” along with verified solution blueprints that accelerate time to market.