09
'20
Written on
Flex Power Modules News
09
'20
Written on
Accutronics News
Overcoming instrumentation battery challenges
What are the battery challenges in test and instrumentation equipment?
08
'20
Written on
Mouser News
Mouser Electronics’ New Intelligent Revolution eBook Explores Role of AI in Public Safety
Mouser Electronics Inc. today released Artificial Intelligence: A Multi-Faceted Approach to Safety, the second eBook from The Intelligent Revolution series.
08
'20
Written on
Fischerelektronik News
Case series Eurotainer in a new design
The design case series Eurotainer (ET) from Fischer Elektronik has been expanded to include a new colour for the feet.
08
'20
Written on
Bender News
Protection of persons, fire and plant protection – not an issue?
Modern applications require market-driven solutions. One of these solutions is the new series of AC/DC sensitive SensorPRO residual current monitors with integrated measuring current transformer. Bender expands its portfolio with new sensors and devices for data acquisition and evaluation.
08
'20
Written on
Metz Connect News
Versatile, modern, powerful – the new fiber optic connection box OpDAT ADT
With the new OpDAT ADT junction box, METZ CONNECT has succeeded in adapting and further developing a proven product to meet growing market requirements.
08
'20
Written on
ST News
STMicroelectronics and Advantest Collaborate on Advanced Automated Test Cell for IC Testing
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that they have jointly developed an advanced, fully-automated final-test cell system that improves overall equipment efficiency and quality in semiconductor test and packaging operations.
08
'20
Written on
TDK News
Flash Storage: TDK launches highly reliable SSDs with 3D NAND flash memory
TDK Corporation (TSE:6762) announces a new generation of flash storage products with five series, available December 2020, optimized for industrial, medical, smart grid, transportation and security applications. All five series use GBDriver GS2, TDK’s proprietary NAND flash memory control IC, which supports serial ATA.
08
'20
Written on
NXP News
NXP Extends its Leadership in 5G Infrastructure with 2ⁿᵈ Generation RF Multi-Chip Modules That Amp Up Frequency, Power and Efficiency
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements for cellular base stations.
08
'20
Written on
Nexperia News
