21
'21
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ST News
21
'21
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TDK News
TDK announces the ASIL-B upgrade of its 3D HAL® direct-angle sensor family HAL 37xy
TDK Corporation (TSE:6762) has upgraded its Micronas 3D HAL® direct-angle Hall-effect sensor family, HAL 37xy (HAL 37xy, HAR 37xy and HAC 37xy)*, for automotive and industrial applications regarding functional safety aspects.
21
'21
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Digi-key News
Digi-Key Electronics Announces New Distribution Partnership with Mini-Circuits
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, announced that it has secured a global distribution partnership with Mini-Circuits to offer their industry-leading MMIC product line up of 50 GHz, LTCC filters, baluns and couplers, and patented reflectionless filters.
21
'21
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Mediatek News
MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software
NANO SoM & evaluation board powered by MediaTek i500 powers portable, home, and commercial IoT applications.
20
'21
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IAR Systems News
IAR Systems boosts development of embedded applications based on NXP’s i.MX RT1160 crossover MCUs
IAR Embedded Workbench® for Arm® now supports all i.MX RT crossover MCUs from NXP® Semiconductors, enabling developers to fully leverage the high performance and the ease of use of these processors.
20
'21
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Digi-key News
Digi-Key Electronics and Bourns, Inc. Celebrate 30 Years of Successful Business Partnership
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has been recognized by Bourns for 30 years of engagement in a successful business relationship.
20
'21
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Anritsu News
Anritsu and Verkotan Collaborate to Deliver 5G OTA Test Services for Mobile Devices
Anritsu Corporation is pleased to announce a collaboration between Anritsu and Verkotan to produce new test services for manufacturers of 5G mobile devices.
20
'21
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PANASONIC ELECTRIC WORKS News
Connected in connectivity
Panasonic Industry announces cooperation with Finnish mesh connectivity provider Wirepas, by combining the popular PAN1780 Bluetooth® 5 Low Energy module with the Wirepas Massive firmware.
20
'21
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Renesas News
Renesas Launches Entry-Level RZ/V2L MPUs with Best-in-Class Power Efficiency and High-Precision AI Accelerator
DRP-AI Handles both AI Inference and Image Processing Functions, Eliminating External ISP Requirements and Enabling More Cost-Efficient Vision AI Implementations.
20
'21
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Allegro micro News
