Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new IGBT power module tailored to the needs of electric vehicle traction inverters in the 80 kW to 100 kW power class: the HybridPACK DC6i.
Governmental regulations all over the world created an urgent need for solutions to secure social distancing in public buildings in order to support slowing down the spread of Covid-19.
STMicroelectronics has released a free STM32 software function pack that lets users quickly build, train, and deploy intelligent edge devices for industrial condition monitoring using a microcontroller Discovery kit.
Small production batches and different formats are setting a new trend among packaging, food, and pharmaceutical sectors. Plant and equipment require components able to offer high flexibility production issues.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched four products in its lineup of new generation 80 V N-channel power MOSFET “U-MOSX-H series” suitable for switching power supplies of industrial equipment. They are “TPH2R408QM” and “TPH4R008QM” that use the SOP Advance(N)[1] surface-mount-type package offering land-pattern's industrial compatibility, and “TPN8R408QM” and “TPN12008QM” that use the TSON Advance package.
Rutronik Elektronische Bauelemente GmbH receives the award as „Best European Automotive Distributor 2019“ for its efforts in opening up new markets and design-in activities in line with the Yageo strategy.
NXP Semiconductors N.V. (NASDAQ: NXPI) today released its eIQ Machine Learning (ML) software support for Glow neural network (NN) compiler, delivering the industry’s first NN compiler implementation for higher performance with low memory footprint on NXP’s i.MX RT crossover MCUs.
In industrial settings, the desire to safely and securely transmit data from devices that use a serial communications port over a wireless network is growing in popularity.