17
'20
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TDK News
17
'20
Written on
Infineon News
Danfoss secures capacities for electro-mobility chips at Infineon
In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
17
'20
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CEA Leti News
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices.
17
'20
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Mitsubishi Electric News
Mitsubishi Electric to Launch N-series 1200V SiC-MOSFET
Low power consumption and miniaturization of power-supply systems, such as EV on-board chargers.
16
'20
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Cadence News
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.
16
'20
Written on
Fraunhofer News
DC smart grids for production halls
The transition to a sustainable energy economy for industrial manufacturing.
16
'20
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Anritsu News
Anritsu Partners with Bluetest AB for 5G FR1/FR2 OTA Measurements
Anritsu Corporation is pleased to announce its enhanced partnership with Bluetest AB of Sweden offering a new unified test solution for Over The Air (OTA) measurement of 5G mobile terminals.
16
'20
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Phoenix Contact News
Mobile thermal transfer printer for creating markings directly on site
The new handy THERMOMARK GO thermal transfer printer from Phoenix Contact allows you to create markings flexibly, anywhere, and at any time.
16
'20
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Congatec News
See and understand
congatec presents Intel IoT RFP Kit for workload consolidation in vision based situational awareness applications.
16
'20
Written on
Paragraf News
