16
'19
Written on
Beijer Electronics Products AB News
16
'19
Written on
SICK News
SICK’s 3D CAMERA GOES PROGRAMMABLE IN A SNAPSHOT
SICK has made its powerful Visionary T 3D snapshot camera programmable, so it can run user-specific image processing applications developed in its pioneering AppSpace software development ecosystem.
13
'19
Written on
ST News
STM8 Nucleo Boards
The highly affordable Nucleo boards allow anyone to try out new ideas and to quickly create prototypes with any STM8 MCU.
13
'19
Written on
Mouser News
Mouser Electronics Now Stocking Analog Devices ADRF5545A RF Front End for Massive MIMO Designs
Mouser Electronics the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the ADRF5545A RF front end module from Analog Devices, Inc.
13
'19
Written on
Ametek News
AMETEK Process Instruments Introduces WDG-V UOP RP Analyzer for Europe and International CCR Projects
AMETEK Process Instruments has broadened its line of Thermox WDG-V series flue gas analyzers to include the WDG-V UOP/RP for oxygen measurement in continuous catalyst regeneration (CCR) platforming / catalytic reforming processes.
12
'19
Written on
Toshiba News
Toshiba launches a range of general-purpose system power ICs for automotive applications
Sophisticated devices supporting multiple output voltages and functional safety for ASIL-D applications.
12
'19
Written on
Mouser News
InvenSense MOD_CH101 and DK-CH101 Ultrasonic Time-of-Flight Sensor Solutions
Mouser Electronics, the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company.
11
'19
Written on
Advantech Embedded-IoT Group
Rugged Pico-ITX MIO-2361 SBC Featuring Onboard LPDDR4 & eMMC
Advantech (2395.TW), a leading global provider of intelligent IoT systems and embedded platforms, is pleased to announce MIO-2361, the latest Pico-ITX single board computer designed with onboard LPDDR4-2400 & 32G eMMC powered by Intel® Atom™ E3900 series/Pentium® N4200/Celeron® N3350 processors.
11
'19
Written on
Autodesk News
New Electronics Capabilities Are Coming to Fusion 360
This year at Autodesk University, we’re celebrating the opportunity to design and make better products while using a better cloud-connected product development platform. In that spirit, we’re announcing a new electronics environment in Fusion 360 to further enhance our customers’ capacity to innovate.
11
'19
Written on
Vision Components News
