23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

CEA Leti News

New consortium to develop a 5G and beyond strategic roadmap

The "COREnect" (European Core Technologies for future connectivity systems and components) consortium is glad to announce that its project has been selected by the European Commission in the frame of the Horizon 2020 Research & Innovation programme.

Read more…

23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Launches Portable 400G Network Tester MT1040A

Versatile Support from Product Inspection to I&M Testing.

Read more…

23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

ElectroCraft

ElectroCraft, Inc. Expands the AxialPower Family of Linear Actuators with the APES 17

ElectroCraft, Inc., the global fractional horsepower motor and motion solutions provider, has expanded its linear actuator lineup for the AxialPower family with the APES17.

Read more…

23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

Leuze

The specialist for confectionery and baked goods packaging machines: The new DRT 25C from Leuze

The primary and secondary packaging of confectionery and baked goods can be challenging: The new DRT 25C dynamic reference diffuse sensor from Leuze solves precisely this problem in an innovative and reliable way: with unique reference technology and three light spots.

Read more…

23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

Sigmatek News

Safe Relay Module for the DIN Rail: The SRO 022

The modular S-DIAS Safety system is being expanded with the relay output module SRO 022, with which high voltages up to 230 V/ 6 A can now also be controlled with Safety-orientation.

Read more…

23 {{ "2020-07-23T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-23T00:00:00+00:00" | date "longDate" }}

Toshiba News

New 1500pixel Image Sensor Arrays from Toshiba Accelerate AOI Throughput Figures

Leveraging the sensitivity of CCD technology while supporting high-speed operation.

Read more…

22 {{ "2020-07-22T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-22T00:00:00+00:00" | date "longDate" }}

Rutronik News

Now worldwide: Rutronik and Samsung Electro- Mechanics extend partnership

Samsung Electro-Mechanics (SEMCO), a subsidiary of the Samsung Group with headquarter in South Korea, is one of the leading suppliers of passive components. The expansion of the partnership with the Rutronik Elektronische Bauelemente GmbH in North America represents a strategic milestone for both partners for the further development of the global market presence of SEMCO ceramic capacitors in the automotive sector.

Read more…

22 {{ "2020-07-22T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-22T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Delivers Secure, Scalable Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

NXP Semiconductors N.V. announced that its Wi-Fi^® and Wi-Fi/Bluetooth^® combos and i.MX RT Crossover MCUs are now supported within its MCUXpresso software, which dramatically simplifies product development.

Read more…

22 {{ "2020-07-22T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-22T00:00:00+00:00" | date "longDate" }}

TDK News

Power Supplies: Fast Response, Multi-Functional DC Electronic Load SFL series

TDK Corporation (TSE:6762) announces the start of selling new TDK-Lambda brand Electronics Load Equipment “SFL Series”. TDK-Lambda Corporation will start shipping in July 2020.

Read more…

21 {{ "2020-07-21T00:00:00+00:00" | date "MMM" }} '20

Written on {{ "2020-07-21T00:00:00+00:00" | date "longDate" }}

ONSEMI news

ON Semiconductor Provides Secure End-to-End Bluetooth^® Low Energy Solution using Veridify Technology

Low-power connectivity provided by Bluetooth 5 RSL10 radio enhanced by Veridify’s ISO 26262 ASIL D certified security tools.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

New consortium to develop a 5G and beyond strategic roadmap

The "COREnect" (European Core Technologies for future connectivity systems and components) consortium is glad to announce that its project has been selected by the European Commission in the frame of the Horizon 2020 Research & Innovation programme.

Anritsu Launches Portable 400G Network Tester MT1040A

Versatile Support from Product Inspection to I&M Testing.

ElectroCraft, Inc. Expands the AxialPower Family of Linear Actuators with the APES 17

ElectroCraft, Inc., the global fractional horsepower motor and motion solutions provider, has expanded its linear actuator lineup for the AxialPower family with the APES17.

The specialist for confectionery and baked goods packaging machines: The new DRT 25C from Leuze

The primary and secondary packaging of confectionery and baked goods can be challenging: The new DRT 25C dynamic reference diffuse sensor from Leuze solves precisely this problem in an innovative and reliable way: with unique reference technology and three light spots.

Safe Relay Module for the DIN Rail: The SRO 022

The modular S-DIAS Safety system is being expanded with the relay output module SRO 022, with which high voltages up to 230 V/ 6 A can now also be controlled with Safety-orientation.

New 1500pixel Image Sensor Arrays from Toshiba Accelerate AOI Throughput Figures

Leveraging the sensitivity of CCD technology while supporting high-speed operation.

Now worldwide: Rutronik and Samsung Electro- Mechanics extend partnership

NXP Delivers Secure, Scalable Edge-Connected Platforms Based on its i.MX RT Crossover MCUs and Wi-Fi/Bluetooth Solutions

NXP Semiconductors N.V. announced that its Wi-Fi^® and Wi-Fi/Bluetooth^® combos and i.MX RT Crossover MCUs are now supported within its MCUXpresso software, which dramatically simplifies product development.

Power Supplies: Fast Response, Multi-Functional DC Electronic Load SFL series

TDK Corporation (TSE:6762) announces the start of selling new TDK-Lambda brand Electronics Load Equipment “SFL Series”. TDK-Lambda Corporation will start shipping in July 2020.

ON Semiconductor Provides Secure End-to-End Bluetooth^® Low Energy Solution using Veridify Technology

Low-power connectivity provided by Bluetooth 5 RSL10 radio enhanced by Veridify’s ISO 26262 ASIL D certified security tools.

International

Market Overview

Technical Articles

Case studies

The "COREnect" (European Core Technologies for future connectivity systems and components) consortium is glad to announce that its project has been selected by the European Commission in the frame of the Horizon 2020 Research & Innovation programme.

Versatile Support from Product Inspection to I&M Testing.

ElectroCraft, Inc., the global fractional horsepower motor and motion solutions provider, has expanded its linear actuator lineup for the AxialPower family with the APES17.

The primary and secondary packaging of confectionery and baked goods can be challenging: The new DRT 25C dynamic reference diffuse sensor from Leuze solves precisely this problem in an innovative and reliable way: with unique reference technology and three light spots.

The modular S-DIAS Safety system is being expanded with the relay output module SRO 022, with which high voltages up to 230 V/ 6 A can now also be controlled with Safety-orientation.

Leveraging the sensitivity of CCD technology while supporting high-speed operation.

NXP Semiconductors N.V. announced that its Wi-Fi® and Wi-Fi/Bluetooth® combos and i.MX RT Crossover MCUs are now supported within its MCUXpresso software, which dramatically simplifies product development.

TDK Corporation (TSE:6762) announces the start of selling new TDK-Lambda brand Electronics Load Equipment “SFL Series”. TDK-Lambda Corporation will start shipping in July 2020.

Low-power connectivity provided by Bluetooth 5 RSL10 radio enhanced by Veridify’s ISO 26262 ASIL D certified security tools.

International

NXP Semiconductors N.V. announced that its Wi-Fi^® and Wi-Fi/Bluetooth^® combos and i.MX RT Crossover MCUs are now supported within its MCUXpresso software, which dramatically simplifies product development.