27 {{ "2019-11-27T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-27T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron expands its AMD Ryzen™ CPU range of the COMe-cVR6 (E2) with new variants for extended industrial temperature applications

COM Express^® modules with AMD's latest Accelerated Processor Unit (APU) provide highest scalability and graphics performance with a small footprint.

Read more…

26 {{ "2019-11-26T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-26T00:00:00+00:00" | date "longDate" }}

Nidec News

NIDEC ASI PRESENTS AT ADIPEC THE FIRST SERIES OF VARIABLE FREQUENCY DRIVES WITH A VERY LOW-ENVIRONMENTAL-IMPACT, WHICH CAN BE MONITORED VIA APP

Nidec presented its new medium-voltage variable frequency drive at the Abu Dhabi International Petroleum Exhibition & Conference (ADIPEC).

Read more…

26 {{ "2019-11-26T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-26T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures

ST8500 smart-meter chipset now integrates both RF and PLC communication.

Read more…

26 {{ "2019-11-26T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-26T00:00:00+00:00" | date "longDate" }}

Dunkermotoren News

DUNKERMOTOREN WINS AT THE LEAP AWARDS

Dunkermotoren has won two silver medals at the LEAP Awards for best components in mechanical and electrical engineering design.

Read more…

26 {{ "2019-11-26T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-26T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS FACTORY AUTOMATION

Using the Internet of Things for Fill-Level Monitoring and Mobile Container Positioning

The Wilsen.sonic.level sensor system provides a solution that allows the fill levels of containers, tanks, and silos to be monitored and managed remotely.

Read more…

26 {{ "2019-11-26T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-26T00:00:00+00:00" | date "longDate" }}

PEPPERL+FUCHS PROCESS AUTOMATION

BTC14 Box Thin Client

The industrial box thin clients from Pepperl+Fuchs are a reliable and rugged generation of computers for visualizing process information. They have been specially developed for use in harsh conditions and 24/7 operation in industrial environments.

Read more…

25 {{ "2019-11-25T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-25T00:00:00+00:00" | date "longDate" }}

Vega News

VEGA extends its portfolio

One special feature of the new sensors is the 360° switching status display, which can be customised from 256 different colours and quickly recognized from any direction.

Read more…

24 {{ "2019-11-24T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-24T00:00:00+00:00" | date "longDate" }}

Vishay News

New Vishay Intertechnology High Speed IR Emitters Deliver 30 % Higher Brightness, Eliminate Unwanted Side Emissions

850 nm, 890 nm, and 940 nm Devices Offer Radiant Intensity to 13 mW/sr in Compact 0805 SMD Package With Opaque Side Walls and -40 °C to +110 °C Temperature Range.

Read more…

21 {{ "2019-11-21T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-21T00:00:00+00:00" | date "longDate" }}

Advantech Embedded-IoT Group

Advantech Launches Palm Size Embedded System EPC-U2117

Advantech, a leading embedded computing provider announces its latest fanless embedded system EPC-U2117. The palm-sized system uses the latest Intel^® Atom^® E3900 processor technology to give a 30% CPU performance enhancement and a 45% graphic performance boost.

Read more…

21 {{ "2019-11-21T00:00:00+00:00" | date "MMM" }} '19

Written on {{ "2019-11-21T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba launches compact resettable eFuse IC providing safety for low voltage applications

Electronic fuse solution provides multiple protection options for power supply lines.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Kontron expands its AMD Ryzen™ CPU range of the COMe-cVR6 (E2) with new variants for extended industrial temperature applications

COM Express^® modules with AMD's latest Accelerated Processor Unit (APU) provide highest scalability and graphics performance with a small footprint.

NIDEC ASI PRESENTS AT ADIPEC THE FIRST SERIES OF VARIABLE FREQUENCY DRIVES WITH A VERY LOW-ENVIRONMENTAL-IMPACT, WHICH CAN BE MONITORED VIA APP

Nidec presented its new medium-voltage variable frequency drive at the Abu Dhabi International Petroleum Exhibition & Conference (ADIPEC).

STMicroelectronics Adds Wireless Support to Proven Smart-Meter Chipset for More Flexible, Scalable Smart Infrastructures

ST8500 smart-meter chipset now integrates both RF and PLC communication.

DUNKERMOTOREN WINS AT THE LEAP AWARDS

Dunkermotoren has won two silver medals at the LEAP Awards for best components in mechanical and electrical engineering design.

Using the Internet of Things for Fill-Level Monitoring and Mobile Container Positioning

The Wilsen.sonic.level sensor system provides a solution that allows the fill levels of containers, tanks, and silos to be monitored and managed remotely.

BTC14 Box Thin Client

The industrial box thin clients from Pepperl+Fuchs are a reliable and rugged generation of computers for visualizing process information. They have been specially developed for use in harsh conditions and 24/7 operation in industrial environments.

VEGA extends its portfolio

One special feature of the new sensors is the 360° switching status display, which can be customised from 256 different colours and quickly recognized from any direction.

New Vishay Intertechnology High Speed IR Emitters Deliver 30 % Higher Brightness, Eliminate Unwanted Side Emissions

850 nm, 890 nm, and 940 nm Devices Offer Radiant Intensity to 13 mW/sr in Compact 0805 SMD Package With Opaque Side Walls and -40 °C to +110 °C Temperature Range.

Advantech Launches Palm Size Embedded System EPC-U2117

Advantech, a leading embedded computing provider announces its latest fanless embedded system EPC-U2117. The palm-sized system uses the latest Intel^® Atom^® E3900 processor technology to give a 30% CPU performance enhancement and a 45% graphic performance boost.

Toshiba launches compact resettable eFuse IC providing safety for low voltage applications

Electronic fuse solution provides multiple protection options for power supply lines.

International

Technical Articles

Case studies

White Paper

COM Express® modules with AMD's latest Accelerated Processor Unit (APU) provide highest scalability and graphics performance with a small footprint.

Nidec presented its new medium-voltage variable frequency drive at the Abu Dhabi International Petroleum Exhibition & Conference (ADIPEC).

ST8500 smart-meter chipset now integrates both RF and PLC communication.

Dunkermotoren has won two silver medals at the LEAP Awards for best components in mechanical and electrical engineering design.

The Wilsen.sonic.level sensor system provides a solution that allows the fill levels of containers, tanks, and silos to be monitored and managed remotely.

The industrial box thin clients from Pepperl+Fuchs are a reliable and rugged generation of computers for visualizing process information. They have been specially developed for use in harsh conditions and 24/7 operation in industrial environments.

One special feature of the new sensors is the 360° switching status display, which can be customised from 256 different colours and quickly recognized from any direction.

850 nm, 890 nm, and 940 nm Devices Offer Radiant Intensity to 13 mW/sr in Compact 0805 SMD Package With Opaque Side Walls and -40 °C to +110 °C Temperature Range.

Advantech, a leading embedded computing provider announces its latest fanless embedded system EPC-U2117. The palm-sized system uses the latest Intel® Atom® E3900 processor technology to give a 30% CPU performance enhancement and a 45% graphic performance boost.

Electronic fuse solution provides multiple protection options for power supply lines.

International

COM Express^® modules with AMD's latest Accelerated Processor Unit (APU) provide highest scalability and graphics performance with a small footprint.

Advantech, a leading embedded computing provider announces its latest fanless embedded system EPC-U2117. The palm-sized system uses the latest Intel^® Atom^® E3900 processor technology to give a 30% CPU performance enhancement and a 45% graphic performance boost.