STMicroelectronics’ EVL400W-EUPL7 evaluation board delivers a ready-to-use 400-Watt power-supply solution that meets today’s toughest eco-design norms. The board leverages innovative features of ST’s L4984D current-mode PFC controller and L6699 resonant half-bridge controller to maximize energy efficiency in multiple operating modes.
NGK INSULATORS, LTD. (hereinafter "NGK") based in Nagoya, Japan, announced that it will exhibit a maintenance-free small power source module for IoT devices at CES 2020 jointly with TOREX SEMICONDUCTOR LTD. (President: Koji Shibamiya, Headquarters: Chuo-ku, Tokyo; hereinafter “TOREX”).
The city of Speyer in the state of Rheinland-Palatinate was Germany’s “lightning capital” in 2019. Siemens’ lightning information service BLIDS (which stands for Blitz-Informationsdienst von Siemens) detected just under 3.1 lightning strikes per square kilometer in Speyer in 2019.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced a new device structure that improves the reliability of SiC MOSFET [1]. Schottky barrier diodes [2] (SBDs) embedded into the MOSFET realize a structure that improves reliability more than 10 times [3] compared to Toshiba’s typical structure while suppressing any rise in on-resistance.
OPERATING TEMPERATURE DEMAND FOR ELECTRONIC COMPONENT. HE NEW BATTERY IS SCHEDULED FOR MASS PRODUCTION IN SEPTEMBER 2020, WITH POTENTIAL APPLICATIONS PRIMARILY IN AUTOMOTIVE AND INDUSTRIAL IOT DEVICES.
The new certifications provide OEMs, systems integrators and end users with independent verification that devices will perform as expected worldwide, Featuring the Qualcomm® Snapdragon X55 5G Modem-RF System, the FN980 series supports mmWave, sub-6GHz FDD/TDD, LTE-5G NR and full 5G NR standalone mode.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a new IGBT power module tailored to the needs of electric vehicle traction inverters in the 80 kW to 100 kW power class: the HybridPACK DC6i.