23
'20
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GCT News
23
'20
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CEA Leti News
CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration
In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.
23
'20
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SOURIAU – SUNBANK Connection Technologies
The SOURIAU 8STA series, a benchmark for high-performance connectors in the world of motorsport
Its compact size and low mass, coupled with its incredible robustness and resistance to shock and vibration have made SOURIAU's 8STA the connector of choice for racing teams at the highest level of the sport looking for the state-of-the-art to improve the electrical performance of their machines. These connectors are commonly used on steering boss systems, temperature and pressure sensors, data acquisition and electronic control systems and inside fuel tanks.
22
'20
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Intel News
Intel Announces Unmatched AI and Analytics Platform with New Processor, Memory, Storage and FPGA Solutions
Intel introduced its 3rd Gen Intel® Xeon® Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of artificial intelligence (AI) and analytics workloads running in data center, network and intelligent-edge environments.
21
'20
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Stemmer imaging News
Raman spectroscopy measures corona infected cells
With BioRam®, CellTool has developed a Raman microscope system that allows to identify and characterize cells without labelling – solely based on interaction of photons with biomolecules of a cell. The recorded Raman spectra are as unique as a fingerprint.
21
'20
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GEA GROUP News
Sales start for GEA's T.VIS® control top with IO-Link technology on July 1, 2020
The degree of automation in production plants in the food, dairy and beverage industry is constantly increasing. This also increases the demand for intelligent field devices. Sooner or later this leads to a confusing multitude of interfaces with different mechanical and electrical characteristics. In general, the solution to this challenge is called IO-Link and GEA's T.VIS® control top are now available with this technology.
20
'20
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Rohm Semiconductors News
New 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance
Advanced design expected to see widespread adoption in the main drive inverters of EVs.
20
'20
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Keysight technologies News
Keysight First to Launch Photovoltaic Array Simulators that Deliver 20 Kilowatts in a 3U Format
Keysight’s next generation PV8900 enables engineers to maximize solar power conversion.
19
'20
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ST News
STMicroelectronics Accelerates Creation of Advanced High-Efficiency Power Solutions with STM32 Digital-Power Ecosystem
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, has launched a web-based ecosystem to help designers build digital-power solutions using STM32 microcontrollers (MCUs).
19
'20
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Hanwha News
