27
'23
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innodisk
27
'23
Written on
Teledyne Flir OEM
New Thermal by FLIR Powered Mobile Phones and Smart Building Sensor Featured at Mobile World Congress
New Thermal by FLIR-Enabled Products Deliver Greater Flexibility and Accessibility with Connected Mobile Devices and Smart Building.
27
'23
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Infineon News
Infineon’s 256 Mbit SEMPER Nano NOR Flash memory enables smaller, power-efficient industrial and consumer electronics
Infineon Technologies AG today launched the SEMPER Nano NOR Flash memory optimized for battery-powered, small-form-factor electronic devices.
25
'23
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Infineon News
Infineon presents user-friendly LCC design tool, enabling highly efficient LED driver design
Lighting accounts for a significant portion of the world’s total electricity consumption, emphasizing the importance of energy-efficient solutions in this sector.
24
'23
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Sivers Semiconductors News
Intel and WiSig Network launching first stand-alone 5G mmWave solution targeting India market
Sivers Semiconductors is proud to announce a collaboration with Intel and WiSig Network to launch the world's first 5G millimeter-wave FR2 stand-alone CPE solution.
24
'23
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Mouser News
Mouser Wins Amphenol Military & Aerospace Europe High Service Web Distributor Award
Mouser Electronics, announces that it has received the AMAO Europe High Service Web Distributor award for 2021 from Amphenol.
24
'23
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ST News
STMICROELECTRONICS REVEALS ULTRA-COMPACT, LOW-POWER, NB-IOT INDUSTRIAL MODULES
The new ST87M01 series of ultra-compact and low-power modules combine highly reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets.
24
'23
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NEC Corporation News
DOCOMO AND NEC COMPLETE DESIGNING CARRIER-GRADE, HYBRID CLOUD, REDUNDANT 5GC
The design will allow DOCOMO to switch between DOCOMO's on-premises NFV and AWS infrastructure for 5GC redundancy operations, offering a more flexible and cost-effective means to manage network performance and capacity.
24
'23
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Anritsu News
ANRITSU AND INTERDIGITAL DEMONSTRATE METAVERSE SIMULATION ENVIRONMENT
To be shown live at the Mobile World Congress Barcelona (Hall 5 Stand D41), the demonstration will combine a 5G communications environment developed by Anritsu with an immersive metaverse user experience provided by InterDigital.
24
'23
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Mediatek News
