23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon launches new NFC I2C bridge tag for contactless authentication and secured configuration of IoT devices

The number of IoT devices is rapidly increasing, and they have already become a part of every industry. However, as the number of smart devices increases, so do the demands on the user experience in terms of simplicity of device configuration and pairing.

Read more…

23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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Mouser News

Mouser Explores the World of 5G with Extensive Technical Resource Center and New Products for Engineers

Mouser Electronics the New Product Introduction (NPI) leader™ empowering innovation, provides engineers with insightful and trusted resources in its 5G content hub.

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23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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AMD News

AMD Instinct MI300X Accelerators Power Microsoft Azure OpenAI Service Workloads and New Azure ND MI300X V5 VMs

Microsoft is using VMs powered by AMD Instinct MI300X and ROCm software to achieve leading price/performance for GPT workloads.

Read more…

23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

New demonstration board from STMicroelectronics kickstarts dual-motor designs for advanced industrial and consumer products

Highly integrated STSPIN32G4 motor controller accelerates time to market leveraging STM32 ecosystem.

Read more…

23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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Wise-integration News

Wise-integration & Leadtrend Technology Introduce GaN System-in-Package Targeting Rapid Consumer Device Charging

SiP Includes Wise-integration’s 650V E-Mode Gallium-Nitride (GaN) Transistor Die And Leadtrend’s Silicon Die Flyback Controller.

Read more…

23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology AEC-Q102 Qualified IR Emitters Deliver 10 % Higher Radiant Intensity in 20 % Smaller Footprint

For Automotive Applications, 850 nm and 940 nm Devices Offer High Drive Currents to 1.5 A DC and 5 A Pulsed, Radiant Intensity to 6000 mW/sr in 3.4 mm by 3.4 mm SMD Packages.

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23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

ROHM and Nanjing SemiDrive Technology jointly Develop a Reference Design: Utilizing PMICs and SerDes ICs for SoC

Contributes to spread of smart vehicle cockpits.

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23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-23T00:00:00+00:00" | date "longDate" }}

Allegro Micro Systems News

ALLEGRO MICROSYSTEMS EXPANDS ISOLATED GATE DRIVER PORTFOLIO WITH POWER-THRU COMBO CHIP

The new product provides engineers with greater flexibility in designing for higher power output in EV chargers.

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23 {{ "2024-05-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-23T00:00:00+00:00" | date "longDate" }}

TDK News

TDK INTRODUCES NEW ULTRA-THIN, LIGHTWEIGHT PERMALLOY FILM SHEETS TO SHIELD LOW-FREQUENCY BAND NOISE

This new material effectively shields low-frequency band noise, which is becoming a growing issue in electric vehicles (EVs).

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22 {{ "2024-05-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-05-22T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron's Single Board Computer 3.5”-SBC-AML/ADN with Intel Atom x7000(R)E-, Intel Core i3 N- & Intel N-Series Processors

Perfect for IoT edge devices with highest security, low power consumption and low latency.

Read more…

The number of IoT devices is rapidly increasing, and they have already become a part of every industry. However, as the number of smart devices increases, so do the demands on the user experience in terms of simplicity of device configuration and pairing.

Mouser Electronics the New Product Introduction (NPI) leader™ empowering innovation, provides engineers with insightful and trusted resources in its 5G content hub.

Microsoft is using VMs powered by AMD Instinct MI300X and ROCm software to achieve leading price/performance for GPT workloads.

Highly integrated STSPIN32G4 motor controller accelerates time to market leveraging STM32 ecosystem.

SiP Includes Wise-integration’s 650V E-Mode Gallium-Nitride (GaN) Transistor Die And Leadtrend’s Silicon Die Flyback Controller.

For Automotive Applications, 850 nm and 940 nm Devices Offer High Drive Currents to 1.5 A DC and 5 A Pulsed, Radiant Intensity to 6000 mW/sr in 3.4 mm by 3.4 mm SMD Packages.

Contributes to spread of smart vehicle cockpits.

The new product provides engineers with greater flexibility in designing for higher power output in EV chargers.

This new material effectively shields low-frequency band noise, which is becoming a growing issue in electric vehicles (EVs).

Perfect for IoT edge devices with highest security, low power consumption and low latency.

International