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TTI News
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MURATA News
MURATA INTRODUCES WORLD’S SMALLEST HIGH-Q 100V MLCC
The GJM022 is an ideal choice for a wide variety of applications, such as impedance matching and DC cutting applications within RF modules for base stations.
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TDK News
TDK EXTENDS AUTOMOTIVE SERIES OF VARISTORS WITH NEW MODELS FOR LIN AND CAN
AVRH series is compliant with AEC-Q200 automotive standard with high operating temperatures up to 150 °C.
21
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Vishay News
Vishay Intertechnology's redesigned INT-A-PAK IGBT power modules reduce conduction and switching losses
Built on Trench IGBT Technology, Half-Bridge Devices Offer Choice of Low VCE(ON) or Low Eoff for High-Current Inverter Stages.
21
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Toshiba News
Toshiba announces new photorelays for semiconductor test applications
New device offers low voltage drive and high temperature operation.
21
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Anritsu News
Anritsu Enhances Solution to Support 6 GHz Band RF Test for 5G FR1 Devices
Anritsu Corporation has introduced new NR Licensed 6GHz Band Measurement MX800010A-014 software for its MT8000A Radio Communication Test Station. The system now supports RF tests*1 in the 6 GHz band (5.925 GHz to 7.125 GHz) for 5G FR1*2 devices.
21
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Emerson
Emerson’s New Compact, Rugged PC Built to Connect Industrial Floor to Cloud
PACSystems IPC 2010, pre-loaded with Movicon software and PACEdge IIoT platform, delivers high-performance computing for industrial edge data visualization applications.
21
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iBASE News
Next-Gen Digital Signage Solutions with Smart Technologies
IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel® Core™ processors and Intel® Iris® Xe display chips for superior performance and energy efficiency.
21
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Teledyne Flir OEM
Thermal by FLIR Powers New Ruggedized Mobile Phone and Assisted Reality Wearable Solution – on Display at Mobile World Congress
New Devices featuring FLIR Lepton Fill Mobile Device Market Gap and Open New Opportunities with an Intrinsically Safe Wearable.
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Picocom News
