The Pre-molded PPA products with a 2835 footprint offer mechanical flexibility, a 120° wide beam angle, and a compact form factor, providing competitive value at both application and system levels.
Infineon Technologies AG has officially opened the first phase of a new fab in Malaysia that will become the world’s largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab.
Infineon Technologies AG has expanded its GaN portfolio with the CoolGaN™ Drive product family, which includes CoolGaN Drive 700 V G5 single switches and CoolGaN Drive HB 600 V G5 devices, which combine two transistors with integrated gate drivers.