28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Qualcomm News

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Mediatek News

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

dSPACE News

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Harman News

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Wearin'

Wearin provides advancing Police Safety with IoT and AI-Enabled Tactical Vests

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Infineon News

INFINEON UNVEILS HIGH-DENSITY POWER MODULES FOR AI DATA CENTRES

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors launches new 28 GHz 5G mmWave RF Module at Mobile World Congress 2024

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Read more…

26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-26T00:00:00+00:00" | date "longDate" }}

Kontron News

Performance Uplift for High-End Edge Computing Platforms with the Latest Intel^® Xeon^® D-2800 and D-1800 Processors

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Wearin provides advancing Police Safety with IoT and AI-Enabled Tactical Vests

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

INFINEON UNVEILS HIGH-DENSITY POWER MODULES FOR AI DATA CENTRES

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

Sivers Semiconductors launches new 28 GHz 5G mmWave RF Module at Mobile World Congress 2024

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Performance Uplift for High-End Edge Computing Platforms with the Latest Intel^® Xeon^® D-2800 and D-1800 Processors

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.

International

Market Overview

Technical Articles

Case studies

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.

Kontron introduces the COM-HPC® Server Module COMh-sdID based on the Intel® Xeon® D-2800 processor, along with the COMh-sdIL and the COM-Express® basic featuring the Intel® Xeon® D-1800 processor.

International

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Kontron introduces the COM-HPC^® Server Module COMh-sdID based on the Intel^® Xeon^® D-2800 processor, along with the COMh-sdIL and the COM-Express^® basic featuring the Intel^® Xeon^® D-1800 processor.