17 {{ "2023-11-17T00:00:00+00:00" | date "MMM" }} '23

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AMD News

AMD EXPANDS RYZEN EMBEDDED PROCESSOR FAMILY

Ryzen Embedded 7000 Series processors deliver leadership performance and advanced features with a growing partner ecosystem including Advantech, ASRock and DFI.

Read more…

17 {{ "2023-11-17T00:00:00+00:00" | date "MMM" }} '23

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SemiQ News

SemiQ Announces New QSiC™ 1200 V SOT-227 SiC Modules Advancing Energy Standards

Ultra-efficient modules support innovative new designs for EVs, medical power supplies, and solar high-power applications.

Read more…

16 {{ "2023-11-16T00:00:00+00:00" | date "MMM" }} '23

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Diodes Incorporated News

Low-Power 1.8V, 2.5Gbps, Two Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY 1.2 Protocols

Diodes Incorporated releases a low-power, high-performance MIPI^® D-PHY 1.2 compliant signal ReDriver™.

Read more…

16 {{ "2023-11-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-16T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon extends line of radiation-hardened asynchronous static RAMs with embedded ECC for space and other extreme environment applications

Edge computing and inference in satellites enables near real-time data analysis and decision making. This is becoming increasingly important as the number of connected devices and the amount of data they generate continue to grow.

Read more…

16 {{ "2023-11-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-16T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

Silicon Labs Expands MCU Platform with new 8-bit MCU family

New BB5 family provides more development choices for simple applications.

Read more…

16 {{ "2023-11-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK PRESENTS 12V OUTPUT 2040W 3-PHASE INDUSTRIAL POWER SUPPLY

Delivering up to 2040W output power (12V at 170A) in a 2U high package, the TPS4000 series operates from a wide range Delta or Wye 350 - 528Vac three phase input.

Read more…

15 {{ "2023-11-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-15T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT INTRODUCES AUTOMATED IN-CIRCUIT TEST SYSTEM

The new Keysight i3070 Series 7i E9988GL inline, high-density in-circuit test (ICT) features the latest Quad-Density pin cards that can provide up to 5760 test nodes in a slim footprint.

Read more…

15 {{ "2023-11-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-15T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM

congatec introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness.

Read more…

15 {{ "2023-11-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-15T00:00:00+00:00" | date "longDate" }}

ams OSRAM News

Vital signs monitoring capabilities get a boost thanks to ams OSRAM’s ultra-low noise AFE sensor technology for wearables

Highly integrated, the new ultra-low power AS7058 supports sophisticated PPG applications and ECG and electrodermal activity measurements.

Read more…

15 {{ "2023-11-15T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-15T00:00:00+00:00" | date "longDate" }}

Qualcomm News

INTRODUCING QUALCOMM CLOUD AI 100 ULTRA

The Qualcomm Cloud AI 100 Ultra uses Qualcomm’s industry-leading AI cores to deliver up to four times the performance of the previous generation.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

AMD EXPANDS RYZEN EMBEDDED PROCESSOR FAMILY

Ryzen Embedded 7000 Series processors deliver leadership performance and advanced features with a growing partner ecosystem including Advantech, ASRock and DFI.

SemiQ Announces New QSiC™ 1200 V SOT-227 SiC Modules Advancing Energy Standards

Ultra-efficient modules support innovative new designs for EVs, medical power supplies, and solar high-power applications.

Low-Power 1.8V, 2.5Gbps, Two Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY 1.2 Protocols

Diodes Incorporated releases a low-power, high-performance MIPI^® D-PHY 1.2 compliant signal ReDriver™.

Infineon extends line of radiation-hardened asynchronous static RAMs with embedded ECC for space and other extreme environment applications

Edge computing and inference in satellites enables near real-time data analysis and decision making. This is becoming increasingly important as the number of connected devices and the amount of data they generate continue to grow.

Silicon Labs Expands MCU Platform with new 8-bit MCU family

New BB5 family provides more development choices for simple applications.

TDK PRESENTS 12V OUTPUT 2040W 3-PHASE INDUSTRIAL POWER SUPPLY

Delivering up to 2040W output power (12V at 170A) in a 2U high package, the TPS4000 series operates from a wide range Delta or Wye 350 - 528Vac three phase input.

KEYSIGHT INTRODUCES AUTOMATED IN-CIRCUIT TEST SYSTEM

The new Keysight i3070 Series 7i E9988GL inline, high-density in-circuit test (ICT) features the latest Quad-Density pin cards that can provide up to 5760 test nodes in a slim footprint.

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM

congatec introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness.

Vital signs monitoring capabilities get a boost thanks to ams OSRAM’s ultra-low noise AFE sensor technology for wearables

Highly integrated, the new ultra-low power AS7058 supports sophisticated PPG applications and ECG and electrodermal activity measurements.

INTRODUCING QUALCOMM CLOUD AI 100 ULTRA

The Qualcomm Cloud AI 100 Ultra uses Qualcomm’s industry-leading AI cores to deliver up to four times the performance of the previous generation.

International

Technical Articles

Case studies

White Paper

Ryzen Embedded 7000 Series processors deliver leadership performance and advanced features with a growing partner ecosystem including Advantech, ASRock and DFI.

Ultra-efficient modules support innovative new designs for EVs, medical power supplies, and solar high-power applications.

Diodes Incorporated releases a low-power, high-performance MIPI® D-PHY 1.2 compliant signal ReDriver™.

Edge computing and inference in satellites enables near real-time data analysis and decision making. This is becoming increasingly important as the number of connected devices and the amount of data they generate continue to grow.

New BB5 family provides more development choices for simple applications.

Delivering up to 2040W output power (12V at 170A) in a 2U high package, the TPS4000 series operates from a wide range Delta or Wye 350 - 528Vac three phase input.

The new Keysight i3070 Series 7i E9988GL inline, high-density in-circuit test (ICT) features the latest Quad-Density pin cards that can provide up to 5760 test nodes in a slim footprint.

congatec introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness.

Highly integrated, the new ultra-low power AS7058 supports sophisticated PPG applications and ECG and electrodermal activity measurements.

The Qualcomm Cloud AI 100 Ultra uses Qualcomm’s industry-leading AI cores to deliver up to four times the performance of the previous generation.

International

Diodes Incorporated releases a low-power, high-performance MIPI^® D-PHY 1.2 compliant signal ReDriver™.