22
'23
Written on
NXP News
22
'23
Written on
Infineon News
Infineon heads European research project for advancing the circular economy and sustainability of the electronics industry
Infineon Technologies AG has taken over as head and coordinator of the broad-scope European research project EECONE (European ECOsystem for greeN Electronics), intended to make electronics in Europe more sustainable.
22
'23
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Renesas News
Renesas Extends Its AIoT Leadership with Integration of Reality AI Tools and e2 studio IDE
Enables Designers to Share Data Between Embedded and AI/ML Projects, Streamlining the Creation of Edge and Endpoint AI Applications.
22
'23
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STMicroelectronics News
STMICROELECTRONICS RELEASES SECURE SOFTWARE FOR STM32-POWERED EDGE DEVICES CONNECTING TO AWS IOT CORE
The new developer software for STM32H5 leverages ST’s Secure Manager to simplify safe connectivity to AWS IoT devices platform.
22
'23
Written on
Telit News
TELIT CINTERION LEVERAGES SNAPDRAGON X72 5G MODEM-RF SYSTEM FOR NEXT GENERATION OF 5G DATA CARDS AND MODULES
These new products target high-performance routers, gateways and CPEs for consumers and enterprises.
21
'23
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Fraunhofer News
Fraunhofer IPMS develops photonic microsystems
These so-called spatial light modulators are micromirror arrays with up to several million mirrors on a semiconductor chip. They have applications in semiconductor manufacturing, microscopy and holography, and have brought the Institute to the forefront of international research in this field.
21
'23
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MIkroe News
Add isolated CAN communication with new Click board from MIKROE
MikroElektronika the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched CAN Isolator 3 Click, a compact add-on board that provides isolated CAN communication.
21
'23
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Infineon News
Infineon and Infypower cooperate to expand presence in new energy vehicle charger market
Power semiconductors based on silicon carbide (SiC) offer several advantages, like high efficiency, power density, voltage resistance, and reliability. This creates opportunities for new applications and improved charging station technology innovations.
21
'23
Written on
TE Connectivity News
A new alliance for standardized data transmission is driving the future of autonomous, connected vehicles
TE and AVIVA have developed a connectivity solution that supports data rates up to 16 Gbps per lane over 10 meters of STP cable and 15 meters of coaxial cable, enabling real-time transmission of high bandwidth video and data for autonomous technology.
21
'23
Written on
OMRON News
