03
'22
Written on
NEC Corporation News
02
'22
Written on
Ambarella News
Ambarella and eInfochips Team on Edge AI Vision Design Services
Ambarella, Inc, an edge AI semiconductor company, and eInfochips, an Arrow Electronics company, a leading provider of product engineering services, today announced a comprehensive relationship to expand design and development services for the next generation of AI camera products based on Ambarella’s industry-leading CVflow® edge AI SoC platform.
02
'22
Written on
CK Switches News
C&K EXPANDS TIRELESS ENDURANCE TACTILE FAMILY WITH LONG TRAVEL VERSION
C&K, now part of Littelfuse, has enhanced the miniature KSC Tireless Endurance (TE) tactile switch series to include a 5.2 mm height version that offers longer travel. Delivering an operating lifetime of up to 10 million cycles, the KSC4 TE switch family simplifies the design cycle and outperforms the competition for its size and force range.
02
'22
Written on
Critical Manufacturing News
An MES Designed for the Future of Semiconductor Manufacturing
At this year's SEMICON Europa, Critical Manufacturing will be highlighting its advanced semiconductor MES capabilities. Designed specifically to manage complex processes within a semiconductor manufacturing environment, this advanced solution fully integrates the shop floor, gives complete visibility of operations, promotes manufacturing agility and innovation, and enables continuous process improvement.
02
'22
Written on
NEC Corporation News
NEC's new iPASOLINK VR4 and IAP3 ODU now support Channel Aggregation to easily double link capacity for 5G networks
NEC Corporation, a leading provider of wireless solutions, today announced the global release of its new iPASOLINK VR4 and IAP3 ODU variants supporting Channel Aggregation (CA) for telecommunications providers looking to cost effectively expand network capacity.
02
'22
Written on
Softing Industrial Automation GmbH
dataFEED OPC Suite Extended from Softing offers additional security for data integration with OPC UA Reverse Connect
With the integration of OPC UA Reverse Connect into its dataFEED OPC Suite Extended V5.22, Softing enables secure communication between OPC UA components in OT and IT that are separated by firewalls or DMZs.
02
'22
Written on
Infineon News
Infineon’s new 8- and 16-Mbit EXCELON F-RAM non-volatile memories now commercially available
Infineon Technologies AG today announced commercial availability of the industry’s highest density serial F-RAMs, the company’s new 8- and 16-Mbit EXCELON F-RAM memories.
01
'22
Written on
Moxa
Moxa Is Futureproofing Industrial Networks to Accelerate Digital Transformation
Today, Moxa, a leader in industrial communications and networking, announced the launch of its next-generation networking portfolio. This new lineup is designed to futureproof industrial networks to accelerate digital transformation across various industrial applications and help organizations improve operational efficiency and resilience.
01
'22
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Digi-Key News
Digi-Key Launches Factory Tomorrow Season 2 Video Series
Digi-Key Electronics, which offers the world’s largest selection of electronic components and automation products in stock for immediate shipment, has released the first episode in Season 2 of its “Factory Tomorrow” video series focused on advancements in automation and control within factories and manufacturing facilities.
31
'22
Written on
ANSYS News
