28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Alps Alpine News

Alps Alpine Commences External Sales of ICs, Starting from a High-Sensitivity Capacitive Sensor IC

Applicable to a Wide Range of Applications Including Touchless Operation, Automotive Touch Panels, and Liquid Level Sensors.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM's EcoGaN™ has been adopted in the 45W Output USB-C Charger C4 Duo from Innergie, a brand of Delta

ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Bulgin News

Bulgin introduces innovative expanded beam fiber optic connector technology

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Launches dsPIC^® DSC-Based Integrated Motor Drivers

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Qualcomm News

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Mediatek News

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

dSPACE News

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

Read more…

27 {{ "2024-02-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-27T00:00:00+00:00" | date "longDate" }}

Harman News

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

White Paper

Maximize Your Power System Efficiency

Alps Alpine Commences External Sales of ICs, Starting from a High-Sensitivity Capacitive Sensor IC

Applicable to a Wide Range of Applications Including Touchless Operation, Automotive Touch Panels, and Liquid Level Sensors.

ROHM's EcoGaN™ has been adopted in the 45W Output USB-C Charger C4 Duo from Innergie, a brand of Delta

ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta.

Bulgin introduces innovative expanded beam fiber optic connector technology

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

Microchip Launches dsPIC^® DSC-Based Integrated Motor Drivers

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

DSPACE PRESENTS NEW MICROLABBOX II

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

International

Technical Articles

Case studies

White Paper

Applicable to a Wide Range of Applications Including Touchless Operation, Automotive Touch Panels, and Liquid Level Sensors.

ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta.

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

The MicroLabBox II is a compact test and development system for rapid control prototyping (RCP) and hardware-in-the-loop (HIL) applications.

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.

International

HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon^® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.