28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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Panasonic Industry News

Ready for your ideas – and available on short lead times: Panasonic Industry’s range of BLE modules

Despite the tense situation on the semiconductor markets for the past two years, Panasonic Industry has invested heavily in stocks - and now reports that, for instance, the Bluetooth^® Low Energy modules from the PAN1780 family are available in exceptionally short lead times now.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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Carlo Gavazzi News

RL: THE LITE SLIMLINE SOLID STATE RELAY SERIES FOR RESISTIVE LOADS

Carlo Gavazzi Automation, the international electronics group with activities in the design, manufacture, and marketing of electronic equipment, today presents a new series of solid state relays and solid state contactors – the RL series.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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NEC Corporation News

NEC becomes First Vendor to be Awarded "Requirements Compliant Bronze Badge" for 5G Open RAN Radio Units in Latest Published TIP Requirements 2.1

NEC Corporation has been awarded a Bronze Badge from the Telecom Infra Project (TIP), this time for complying with the requirements for TIP's OpenRAN RU Technical Requirements Document 2.1.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-28T00:00:00+00:00" | date "longDate" }}

CUI Devices News

New MEMS Microphones Ideal for Active Noise Canceling Applications

CUI Devices’ Audio Group today announced the addition of two MEMS microphone models designed for active noise cancellation. The CMM-2718AB-3815NC-TR and CMM-2718AT-3817NC-TR are analog MEMS microphones featuring omnidirectional directivity and bottom or top port locations, respectively.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-28T00:00:00+00:00" | date "longDate" }}

Rutronik Info

New memory sockets for DDR5 modules: Rutronik introduces DIMM and SO-DIMM sockets from Amphenol

Designed for DDR5 and thus state-of-the-art memory modules, the sockets from Amphenol Communications Solutions enable convenient memory expansion. The SO-DIMM and DIMM sockets in vertical and right-angled orientation provide high flexibility for integration.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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TE Connectivity News

TE Connectivity to showcase latest products at Smart Production Solutions 2022

Sign up for free show ticket to hear from TE experts on industry trends and new products.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

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NXP News

NXP and German Aerospace Center DLR Collaborate on Quantum Computing Technologies in Germany

NXP Semiconductors today announced its collaboration with the German Aerospace Center (DLR) and other partners on ion trap-based quantum computers as part of the DLR’s Quantum Computing Initiative. The initiative aims to build quantum computers to help enable new innovations across energy, automotive, government, aerospace and other critical infrastructure.

Read more…

28 {{ "2022-10-28T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces the 950 V CoolMOS PFD7 family with an integrated fast body diode to address high-power lighting and industrial SMPS applications

To address contemporary market needs for improved form factors and energy-efficient products, Infineon Technologies has developed a new CoolMOS PFD7 high-voltage MOSFET family, setting a new benchmark in 950 V superjunction (SJ) technology.

Read more…

27 {{ "2022-10-27T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-27T00:00:00+00:00" | date "longDate" }}

RAFI News

MICON 5 SAFETY: Micro key switch with two-channel contact system

MICON 5 tactile switches from RAFI are now also available in a new MICON 5 SAFETY version with a two-channel contact system.

Read more…

27 {{ "2022-10-27T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-10-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon launches XENSIV connected sensor kit, a new IoT sensors platform

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until smart IoT systems are ready to be deployed.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

Ready for your ideas – and available on short lead times: Panasonic Industry’s range of BLE modules

Despite the tense situation on the semiconductor markets for the past two years, Panasonic Industry has invested heavily in stocks - and now reports that, for instance, the Bluetooth^® Low Energy modules from the PAN1780 family are available in exceptionally short lead times now.

RL: THE LITE SLIMLINE SOLID STATE RELAY SERIES FOR RESISTIVE LOADS

Carlo Gavazzi Automation, the international electronics group with activities in the design, manufacture, and marketing of electronic equipment, today presents a new series of solid state relays and solid state contactors – the RL series.

NEC becomes First Vendor to be Awarded "Requirements Compliant Bronze Badge" for 5G Open RAN Radio Units in Latest Published TIP Requirements 2.1

NEC Corporation has been awarded a Bronze Badge from the Telecom Infra Project (TIP), this time for complying with the requirements for TIP's OpenRAN RU Technical Requirements Document 2.1.

New MEMS Microphones Ideal for Active Noise Canceling Applications

CUI Devices’ Audio Group today announced the addition of two MEMS microphone models designed for active noise cancellation. The CMM-2718AB-3815NC-TR and CMM-2718AT-3817NC-TR are analog MEMS microphones featuring omnidirectional directivity and bottom or top port locations, respectively.

New memory sockets for DDR5 modules: Rutronik introduces DIMM and SO-DIMM sockets from Amphenol

Designed for DDR5 and thus state-of-the-art memory modules, the sockets from Amphenol Communications Solutions enable convenient memory expansion. The SO-DIMM and DIMM sockets in vertical and right-angled orientation provide high flexibility for integration.

TE Connectivity to showcase latest products at Smart Production Solutions 2022

Sign up for free show ticket to hear from TE experts on industry trends and new products.

NXP and German Aerospace Center DLR Collaborate on Quantum Computing Technologies in Germany

Infineon introduces the 950 V CoolMOS PFD7 family with an integrated fast body diode to address high-power lighting and industrial SMPS applications

To address contemporary market needs for improved form factors and energy-efficient products, Infineon Technologies has developed a new CoolMOS PFD7 high-voltage MOSFET family, setting a new benchmark in 950 V superjunction (SJ) technology.

MICON 5 SAFETY: Micro key switch with two-channel contact system

MICON 5 tactile switches from RAFI are now also available in a new MICON 5 SAFETY version with a two-channel contact system.

Infineon launches XENSIV connected sensor kit, a new IoT sensors platform

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until smart IoT systems are ready to be deployed.

International

Technical Articles

Despite the tense situation on the semiconductor markets for the past two years, Panasonic Industry has invested heavily in stocks - and now reports that, for instance, the Bluetooth® Low Energy modules from the PAN1780 family are available in exceptionally short lead times now.

Carlo Gavazzi Automation, the international electronics group with activities in the design, manufacture, and marketing of electronic equipment, today presents a new series of solid state relays and solid state contactors – the RL series.

NEC Corporation has been awarded a Bronze Badge from the Telecom Infra Project (TIP), this time for complying with the requirements for TIP's OpenRAN RU Technical Requirements Document 2.1.

CUI Devices’ Audio Group today announced the addition of two MEMS microphone models designed for active noise cancellation. The CMM-2718AB-3815NC-TR and CMM-2718AT-3817NC-TR are analog MEMS microphones featuring omnidirectional directivity and bottom or top port locations, respectively.

Designed for DDR5 and thus state-of-the-art memory modules, the sockets from Amphenol Communications Solutions enable convenient memory expansion. The SO-DIMM and DIMM sockets in vertical and right-angled orientation provide high flexibility for integration.

Sign up for free show ticket to hear from TE experts on industry trends and new products.

To address contemporary market needs for improved form factors and energy-efficient products, Infineon Technologies has developed a new CoolMOS PFD7 high-voltage MOSFET family, setting a new benchmark in 950 V superjunction (SJ) technology.

MICON 5 tactile switches from RAFI are now also available in a new MICON 5 SAFETY version with a two-channel contact system.

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based IoT use cases can become a resource intensive process until smart IoT systems are ready to be deployed.

International

Despite the tense situation on the semiconductor markets for the past two years, Panasonic Industry has invested heavily in stocks - and now reports that, for instance, the Bluetooth^® Low Energy modules from the PAN1780 family are available in exceptionally short lead times now.