21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-21T00:00:00+00:00" | date "longDate" }}

iBASE News

Next-Gen Digital Signage Solutions with Smart Technologies

IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel^® Core™ processors and Intel^® Iris^® Xe display chips for superior performance and energy efficiency.

Read more…

21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-21T00:00:00+00:00" | date "longDate" }}

Teledyne Flir OEM

Thermal by FLIR Powers New Ruggedized Mobile Phone and Assisted Reality Wearable Solution – on Display at Mobile World Congress

New Devices featuring FLIR Lepton Fill Mobile Device Market Gap and Open New Opportunities with an Intrinsically Safe Wearable.

Read more…

21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-21T00:00:00+00:00" | date "longDate" }}

Picocom News

Picocom powers Wave Electronics Open RAN equipment

Companies to jointly showcase new O-RU in live end-to-end demonstration at MWC Barcelona 2024.

Read more…

21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-21T00:00:00+00:00" | date "longDate" }}

LEMO

New LEMO Product Family Portfolio Simplifies Selection Process

LEMO has launched an enhanced product family portfolio to streamline customer selection, offering over 90,000 custom solutions to meet market demands, continuously expanding its offerings.

Read more…

20 {{ "2024-02-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-20T00:00:00+00:00" | date "longDate" }}

SemiQ News

Highly-Efficient, Compact MOSFET Modules in Full-Bridge Configurations for Solar Inverter and EV Charging

SemiQ’s high-performance 1200V SiC modules are tested to above 1400V and are designed to operate reliably in high-frequency and high-power environments.

Read more…

20 {{ "2024-02-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-20T00:00:00+00:00" | date "longDate" }}

Inova Semiconductors News

Inova Semiconductors Supplies New APIX3^® SerDes Products with DisplayPort™ Multi-stream Video Interface and Support for up to 4 Daisy-chained Displays

Inova Semiconductors expands its APIX3^® SerDes family with more video channels for daisy-chained display architectures. The new transmitter devices enable simultaneous transmission of multiple videos, audio, Ethernet and data in real time at up to 12 Gbit/s.

Read more…

20 {{ "2024-02-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-20T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

IDS with above-average sales growth in 2023

Clear market orientation and future-orientated cooperations ensure corporate success.

Read more…

20 {{ "2024-02-20T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-20T00:00:00+00:00" | date "longDate" }}

Red Lion Europe

Red Lion Launches New Strain Gauge Modules and J1939 and CAN Protocol Sleds

FlexEdge Intelligent Edge Automation Platform is now scalable with Strain Gauge Modules and J1939 and CAN Protocol Sleds.

Read more…

19 {{ "2024-02-19T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-19T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces lower cost Bluetooth^® long-range module, CYW20822-P4TAI040, for low power applications

Infineon Technologies AG announced the CYW20822-P4TAI040, its latest Bluetooth^® module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics.

Read more…

19 {{ "2024-02-19T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-19T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT AND NVIDIA TO DEMONSTRATE 6G NEURAL RECEIVER DESIGN FLOW AT MWC 2024

The demonstration will feature an Open RAN testbed that has been augmented by a multi-user MIMO neural receiver.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

IDS: See. Align. Place

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

Next-Gen Digital Signage Solutions with Smart Technologies

IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel^® Core™ processors and Intel^® Iris^® Xe display chips for superior performance and energy efficiency.

Thermal by FLIR Powers New Ruggedized Mobile Phone and Assisted Reality Wearable Solution – on Display at Mobile World Congress

New Devices featuring FLIR Lepton Fill Mobile Device Market Gap and Open New Opportunities with an Intrinsically Safe Wearable.

Picocom powers Wave Electronics Open RAN equipment

Companies to jointly showcase new O-RU in live end-to-end demonstration at MWC Barcelona 2024.

New LEMO Product Family Portfolio Simplifies Selection Process

LEMO has launched an enhanced product family portfolio to streamline customer selection, offering over 90,000 custom solutions to meet market demands, continuously expanding its offerings.

Highly-Efficient, Compact MOSFET Modules in Full-Bridge Configurations for Solar Inverter and EV Charging

SemiQ’s high-performance 1200V SiC modules are tested to above 1400V and are designed to operate reliably in high-frequency and high-power environments.

Inova Semiconductors Supplies New APIX3^® SerDes Products with DisplayPort™ Multi-stream Video Interface and Support for up to 4 Daisy-chained Displays

Inova Semiconductors expands its APIX3^® SerDes family with more video channels for daisy-chained display architectures. The new transmitter devices enable simultaneous transmission of multiple videos, audio, Ethernet and data in real time at up to 12 Gbit/s.

IDS with above-average sales growth in 2023

Clear market orientation and future-orientated cooperations ensure corporate success.

Red Lion Launches New Strain Gauge Modules and J1939 and CAN Protocol Sleds

FlexEdge Intelligent Edge Automation Platform is now scalable with Strain Gauge Modules and J1939 and CAN Protocol Sleds.

Infineon introduces lower cost Bluetooth^® long-range module, CYW20822-P4TAI040, for low power applications

Infineon Technologies AG announced the CYW20822-P4TAI040, its latest Bluetooth^® module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics.

KEYSIGHT AND NVIDIA TO DEMONSTRATE 6G NEURAL RECEIVER DESIGN FLOW AT MWC 2024

The demonstration will feature an Open RAN testbed that has been augmented by a multi-user MIMO neural receiver.

International

Technical Articles

Case studies

White Paper

IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel® Core™ processors and Intel® Iris® Xe display chips for superior performance and energy efficiency.

New Devices featuring FLIR Lepton Fill Mobile Device Market Gap and Open New Opportunities with an Intrinsically Safe Wearable.

Companies to jointly showcase new O-RU in live end-to-end demonstration at MWC Barcelona 2024.

LEMO has launched an enhanced product family portfolio to streamline customer selection, offering over 90,000 custom solutions to meet market demands, continuously expanding its offerings.

SemiQ’s high-performance 1200V SiC modules are tested to above 1400V and are designed to operate reliably in high-frequency and high-power environments.

Inova Semiconductors expands its APIX3® SerDes family with more video channels for daisy-chained display architectures. The new transmitter devices enable simultaneous transmission of multiple videos, audio, Ethernet and data in real time at up to 12 Gbit/s.

Clear market orientation and future-orientated cooperations ensure corporate success.

FlexEdge Intelligent Edge Automation Platform is now scalable with Strain Gauge Modules and J1939 and CAN Protocol Sleds.

Infineon Technologies AG announced the CYW20822-P4TAI040, its latest Bluetooth® module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics.

The demonstration will feature an Open RAN testbed that has been augmented by a multi-user MIMO neural receiver.

International

IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel^® Core™ processors and Intel^® Iris^® Xe display chips for superior performance and energy efficiency.

Inova Semiconductors expands its APIX3^® SerDes family with more video channels for daisy-chained display architectures. The new transmitter devices enable simultaneous transmission of multiple videos, audio, Ethernet and data in real time at up to 12 Gbit/s.

Infineon Technologies AG announced the CYW20822-P4TAI040, its latest Bluetooth^® module that pushes the low-power and range boundaries for wireless connectivity in IoT and consumer electronics.