06 {{ "2023-09-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-06T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA SAMPLE SOFTWARE PACKAGE EXPANDS MICROCONTROLLER DEVELOPMENT TOOLS ECOSYSTEM

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm^® Keil^® MDK and IAR Embedded Workbench^® for Arm.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

HARTING USA

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

Using technological innovation for environmental benefits

The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG ELECTRONICS UNVEILS INDUSTRY’S HIGHEST-CAPACITY 12NM-CLASS 32GB DDR5 DRAM

The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.

Read more…

05 {{ "2023-09-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-05T00:00:00+00:00" | date "longDate" }}

ST News

WIRELESS MICROCONTROLLERS MAKE SINDCON SMART METERS MORE EFFICIENT AND SUSTAINABLE

STMicroelectronics announced its collaboration with Sindcon (Singapore) IoT Technology Pte Ltd, a smart meter provider based in Singapore.

Read more…

04 {{ "2023-09-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-04T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Vector Photonics collaborates with Sivers Photonics to evaluate new material for next-generation lasers

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

Read more…

04 {{ "2023-09-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-04T00:00:00+00:00" | date "longDate" }}

ASRockInd News

ASRock Industrial introduces 4X4 BOX 7040 Series mini PC with AMD Ryzen 7040U APU

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads.

Read more…

01 {{ "2023-09-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-01T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics Stocking Wide Selection of Connectivity and Location Products from u-blox

Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.

Read more…

01 {{ "2023-09-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-01T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’s New EcoGaN Power Stage ICs Contribute to Smaller Size and Lower Loss

Reduces component volume by 99% and power loss by 55% when replacing silicon MOSFETs.

Read more…

01 {{ "2023-09-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-09-01T00:00:00+00:00" | date "longDate" }}

Lane Electronics News

Cinch FIBRECO connectors now available from Lane Electronics

Lane Electronics, have signed a new Franchise Agreement with Cinch Connectivity for the distribution of the FIBRECO range of expanded beam fibre-optic connectors across the UK and Europe.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

TOSHIBA SAMPLE SOFTWARE PACKAGE EXPANDS MICROCONTROLLER DEVELOPMENT TOOLS ECOSYSTEM

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm^® Keil^® MDK and IAR Embedded Workbench^® for Arm.

3D-Circuits - Enabling 3D-Placement Of Electronic Components

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

Using technological innovation for environmental benefits

The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.

SAMSUNG ELECTRONICS UNVEILS INDUSTRY’S HIGHEST-CAPACITY 12NM-CLASS 32GB DDR5 DRAM

The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.

WIRELESS MICROCONTROLLERS MAKE SINDCON SMART METERS MORE EFFICIENT AND SUSTAINABLE

STMicroelectronics announced its collaboration with Sindcon (Singapore) IoT Technology Pte Ltd, a smart meter provider based in Singapore.

Vector Photonics collaborates with Sivers Photonics to evaluate new material for next-generation lasers

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

ASRock Industrial introduces 4X4 BOX 7040 Series mini PC with AMD Ryzen 7040U APU

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads.

Mouser Electronics Stocking Wide Selection of Connectivity and Location Products from u-blox

Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.

ROHM’s New EcoGaN Power Stage ICs Contribute to Smaller Size and Lower Loss

Reduces component volume by 99% and power loss by 55% when replacing silicon MOSFETs.

Cinch FIBRECO connectors now available from Lane Electronics

Lane Electronics, have signed a new Franchise Agreement with Cinch Connectivity for the distribution of the FIBRECO range of expanded beam fibre-optic connectors across the UK and Europe.

International

Technical Articles

Case studies

White Paper

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm® Keil® MDK and IAR Embedded Workbench® for Arm.

Engineers are using miniaturized components and flexible or rigid-flex PCBs. However, a very strong trend is 3D packaging. Are you curious whether the chip carrier from HARTING also offers many advantages for your product?.

The industrial camera manufacturer IDS Imaging Development Systems GmbH from Obersulm feels responsible for keeping its ecological footprint as small as possible.

The new product provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%.

STMicroelectronics announced its collaboration with Sindcon (Singapore) IoT Technology Pte Ltd, a smart meter provider based in Singapore.

Sivers Semiconductors has received an initial order from Vector Photonics for the evaluation of epitaxial material for a new, next-generation surface coupling laser project.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 “Zen 4” cores and 16 threads.

Mouser Electronics partners with u-blox, a leading manufacturer of positioning and wireless communication technologies, to support design in automotive, industrial, and consumer applications.

Reduces component volume by 99% and power loss by 55% when replacing silicon MOSFETs.

Lane Electronics, have signed a new Franchise Agreement with Cinch Connectivity for the distribution of the FIBRECO range of expanded beam fibre-optic connectors across the UK and Europe.

International

Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm^® Keil^® MDK and IAR Embedded Workbench^® for Arm.