05 {{ "2024-01-05T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-01-05T00:00:00+00:00" | date "longDate" }}

3M News

3M TO UNVEIL WORLD'S FIRST SELF-CHARGING PROTECTIVE COMMUNICATIONS HEADSET AT CES 2024

The new headset converts outdoor and indoor light into clean, continuous energy, and has the potential to eliminate the need for millions of single-use batteries every year.

Read more…

05 {{ "2024-01-05T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-01-05T00:00:00+00:00" | date "longDate" }}

Rutronik Info

AEC-Q102 qualified device with industry-leading performance: Vishay's new photovoltaic MOSFET drivers at Rutronik

The AEC-Q102-qualified driver combines high performance with greater design flexibility as well as lower costs and is the first device of its kind to be developed with an integrated cut-off for the automotive industry, among others.

Read more…

05 {{ "2024-01-05T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-01-05T00:00:00+00:00" | date "longDate" }}

U Blox News

u-blox module unlocks new automotive use cases

The new u-blox JODY-W6 module features concurrent dual-band Wi-Fi 6E and Bluetooth^® LE Audio and operates even in high temperatures.

Read more…

04 {{ "2024-01-04T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-01-04T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK HYNIX TO EXHIBIT AI MEMORY LEADERSHIP AT CES 2024

SK hynix will highlight its future vision represented by its Memory Centric at the show and promote the importance of memory products.

Read more…

03 {{ "2024-01-03T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-01-03T00:00:00+00:00" | date "longDate" }}

TTI News

TTI Europe signs EMEA distribution agreement with Rosenberger

High-frequency, fiber-optic and high-voltage connectivity solutions added to TTI Europe’s portfolio.

Read more…

22 {{ "2023-12-22T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-22T00:00:00+00:00" | date "longDate" }}

TTI News

TTI Now Stocking Circular Heavy-Duty Connectors from Amphenol Industrial

Designed for high-power EV powertrain applications in harsh conditions. TTI a leading specialty distributor of electronic components, is now stocking CHD (Circular Heavy Duty) connectors from Amphenol Industrial.

Read more…

21 {{ "2023-12-21T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-21T00:00:00+00:00" | date "longDate" }}

Siemens digital Industry Software News

SIEMENS COLLABORATES WITH SURECORE AND SEMIWISE TO PIONEER QUANTUM COMPUTING READY CRYOGENIC SEMICONDUCTOR DESIGNS

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

Read more…

21 {{ "2023-12-21T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-21T00:00:00+00:00" | date "longDate" }}

Digi-Key News

DigiKey Stocks New eFuse Reference Design Product from Vishay

DigiKey, has announced that the EFUSE-48V100A reference design product from Vishay, is now available for purchase globally from DigiKey.

Read more…

20 {{ "2023-12-20T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-20T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec launches COM Express Compact module with brand new Intel^® Core™ Ultra processors

congatec is introducing its latest range of COM Express Compact modules based on the Intel^® Core Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Read more…

20 {{ "2023-12-20T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-12-20T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu and EMITE supporting OTA measurements on IEEE 802.11be (Wi-Fi 7) devices

Anritsu Corporation and EMITE announce the enhanced functionality to the Over-the-Air measurement solution, allowing measuring to compliance with the latest Wireless LAN standard IEEE 802.11be.

Read more…

White Paper

Daisy Chaining for parallel connection of DIN Rail power supplies- considerations and limitations

3M TO UNVEIL WORLD'S FIRST SELF-CHARGING PROTECTIVE COMMUNICATIONS HEADSET AT CES 2024

The new headset converts outdoor and indoor light into clean, continuous energy, and has the potential to eliminate the need for millions of single-use batteries every year.

AEC-Q102 qualified device with industry-leading performance: Vishay's new photovoltaic MOSFET drivers at Rutronik

The AEC-Q102-qualified driver combines high performance with greater design flexibility as well as lower costs and is the first device of its kind to be developed with an integrated cut-off for the automotive industry, among others.

u-blox module unlocks new automotive use cases

The new u-blox JODY-W6 module features concurrent dual-band Wi-Fi 6E and Bluetooth^® LE Audio and operates even in high temperatures.

SK HYNIX TO EXHIBIT AI MEMORY LEADERSHIP AT CES 2024

SK hynix will highlight its future vision represented by its Memory Centric at the show and promote the importance of memory products.

TTI Europe signs EMEA distribution agreement with Rosenberger

High-frequency, fiber-optic and high-voltage connectivity solutions added to TTI Europe’s portfolio.

TTI Now Stocking Circular Heavy-Duty Connectors from Amphenol Industrial

Designed for high-power EV powertrain applications in harsh conditions. TTI a leading specialty distributor of electronic components, is now stocking CHD (Circular Heavy Duty) connectors from Amphenol Industrial.

SIEMENS COLLABORATES WITH SURECORE AND SEMIWISE TO PIONEER QUANTUM COMPUTING READY CRYOGENIC SEMICONDUCTOR DESIGNS

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

DigiKey Stocks New eFuse Reference Design Product from Vishay

DigiKey, has announced that the EFUSE-48V100A reference design product from Vishay, is now available for purchase globally from DigiKey.

congatec launches COM Express Compact module with brand new Intel^® Core™ Ultra processors

congatec is introducing its latest range of COM Express Compact modules based on the Intel^® Core Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Anritsu and EMITE supporting OTA measurements on IEEE 802.11be (Wi-Fi 7) devices

Anritsu Corporation and EMITE announce the enhanced functionality to the Over-the-Air measurement solution, allowing measuring to compliance with the latest Wireless LAN standard IEEE 802.11be.

International

White Paper

The new headset converts outdoor and indoor light into clean, continuous energy, and has the potential to eliminate the need for millions of single-use batteries every year.

The AEC-Q102-qualified driver combines high performance with greater design flexibility as well as lower costs and is the first device of its kind to be developed with an integrated cut-off for the automotive industry, among others.

The new u-blox JODY-W6 module features concurrent dual-band Wi-Fi 6E and Bluetooth® LE Audio and operates even in high temperatures.

SK hynix will highlight its future vision represented by its Memory Centric at the show and promote the importance of memory products.

High-frequency, fiber-optic and high-voltage connectivity solutions added to TTI Europe’s portfolio.

Designed for high-power EV powertrain applications in harsh conditions. TTI a leading specialty distributor of electronic components, is now stocking CHD (Circular Heavy Duty) connectors from Amphenol Industrial.

Collaboration between Siemens, sureCore and Semiwise to develop cryogenic semiconductor designs capable of operating in extreme cold conditions required for quantum computing.

DigiKey, has announced that the EFUSE-48V100A reference design product from Vishay, is now available for purchase globally from DigiKey.

congatec is introducing its latest range of COM Express Compact modules based on the Intel® Core Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Anritsu Corporation and EMITE announce the enhanced functionality to the Over-the-Air measurement solution, allowing measuring to compliance with the latest Wireless LAN standard IEEE 802.11be.

International

The new u-blox JODY-W6 module features concurrent dual-band Wi-Fi 6E and Bluetooth^® LE Audio and operates even in high temperatures.

congatec is introducing its latest range of COM Express Compact modules based on the Intel^® Core Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.