19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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Rutronik Info

Rutronik achieves a new record in the logistics warehouse located in Eisingen

Rutronik Elektronische Bauelemente GmbH achieved a new all-time high in the logistics sector in September. Already during August, the monthly turnover of the European central warehouse of the distribution company exceeded the 100 million Euro mark for the first time. That result was exceeded once again in September, with monthly sales rising to more than 109 million Euros.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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Bosch Rexroth Info

The new generation of linear axes: Ideal for semiconductor production

Quick, dynamic und highly precise: Bosch Rexroth is expanding its range of linear axes by adding a new generation of PSK precision modules.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

TOSHIBA ANNOUNCES 20TB MG10 SERIES HARD DISK DRIVES

Toshiba Electronics Europe GmbH announces the MG10 Series of massive capacity 20TB HDDs with conventional magnetic recording (CMR) . The 20TB MG10 Series has a 10-disk helium-sealed design that leverages Toshiba’s innovative Flux Control Microwave Assisted Magnetic Recording (FC-MAMR) technology to boost storage capabilities.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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ICsense News

ASIC supplier ICsense ramps-up next generation chemical sensor interface device to full-scale production

ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.

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19 {{ "2022-10-19T00:00:00+00:00" | date "MMM" }} '22

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Sivers Semiconductors News

Sivers Semiconductors and Chalmers University of Technology granted 4 MSEK to collaborate in research and development of new generation power amplifiers

Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.

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18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Supermicro collaborates with Infineon on green computing, leverages Infineon’s high-efficiency power stages to reduce data center power usage

The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.

Read more…

18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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Keysight technologies News

Keysight Introduces Automated and AI-Driven Testing to Optimize Experiences on 5G Smartphones

New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.

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18 {{ "2022-10-18T00:00:00+00:00" | date "MMM" }} '22

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NEC Corporation News

NEC to build 5G Innovation lab for the NSW Telco Authority

NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.

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17 {{ "2022-10-17T00:00:00+00:00" | date "MMM" }} '22

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DFI

DFI and AEWIN Partner to Empower Software Virtualization Technology Through AMD Platform Ultra-small Products

DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.

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14 {{ "2022-10-14T00:00:00+00:00" | date "MMM" }} '22

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Flex Power Modules News

Flex Power Modules teams up with onsemi to develop ultra-small Intermediate Bus Converter

Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October.

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Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

Rutronik achieves a new record in the logistics warehouse located in Eisingen

The new generation of linear axes: Ideal for semiconductor production

Quick, dynamic und highly precise: Bosch Rexroth is expanding its range of linear axes by adding a new generation of PSK precision modules.

TOSHIBA ANNOUNCES 20TB MG10 SERIES HARD DISK DRIVES

ASIC supplier ICsense ramps-up next generation chemical sensor interface device to full-scale production

ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.

Sivers Semiconductors and Chalmers University of Technology granted 4 MSEK to collaborate in research and development of new generation power amplifiers

Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.

Supermicro collaborates with Infineon on green computing, leverages Infineon’s high-efficiency power stages to reduce data center power usage

The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.

Keysight Introduces Automated and AI-Driven Testing to Optimize Experiences on 5G Smartphones

New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.

NEC to build 5G Innovation lab for the NSW Telco Authority

NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.

DFI and AEWIN Partner to Empower Software Virtualization Technology Through AMD Platform Ultra-small Products

DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.

Flex Power Modules teams up with onsemi to develop ultra-small Intermediate Bus Converter

Flex Power Modules is announcing the launch of their BMR313 Intermediate Bus Converter (IBC) at the 2022 Open Compute Project global summit in October in San Jose CA 18th of October.

International