16 {{ "2023-08-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-16T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics, Inc. is supplying 100% certified, genuine products from its manufacturing partners

Mouser introduces hundreds of new products each month and supports innovation by supplying engineers with the newest products, technologies and resources.

Read more…

11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-11T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser unveils Digi XBee 3 Global GNSS LTE CAT 1 Development Kit for IoT Applications

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

Read more…

11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-11T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces new automotive 60 V and 120 V OptiMOS 5 in TOLx packages for 24 V-72 V supplied high power ECUs

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

Antaira News

Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

Thinesolutions News

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

Read more…

10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-10T00:00:00+00:00" | date "longDate" }}

FEIG news

FEIG INTRODUCES NEW RFID HYBRID READER MODULE

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Read more…

09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

Inova Semiconductors News

Inova Semiconductors is going to use Samsung Foundry Services for ISELED products

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

Read more…

09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

TDK News

TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

Read more…

09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Teledyne Flir OEM

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Mouser Electronics, Inc. is supplying 100% certified, genuine products from its manufacturing partners

Mouser introduces hundreds of new products each month and supports innovation by supplying engineers with the newest products, technologies and resources.

Mouser unveils Digi XBee 3 Global GNSS LTE CAT 1 Development Kit for IoT Applications

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

Infineon introduces new automotive 60 V and 120 V OptiMOS 5 in TOLx packages for 24 V-72 V supplied high power ECUs

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

FEIG INTRODUCES NEW RFID HYBRID READER MODULE

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Inova Semiconductors is going to use Samsung Foundry Services for ISELED products

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

International

Technical Articles

Case studies

White Paper

Mouser introduces hundreds of new products each month and supports innovation by supplying engineers with the newest products, technologies and resources.

Digi XBee® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

International

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.