28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

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ANSYS News

ANSYS SIMULATION BOOSTS THE THERMAL RELIABILITY OF UPI’S POWER MANAGEMENT PRODUCTS BY 100%

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Solidrun News

High AI performance in a tiny, rugged housing

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon extends its PQFN 2x2 mm² product portfolio with best-in-class OptiMOS power MOSFETs

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser introduces u-blox ZED-F9P-GNSS module for autonomous vehicles and robotics

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

MESH NETWORKS AS EASY AS NEVER BEFORE

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

MURATA News

MURATA EXPANDS ITS RANGE OF STATE-OF-THE-ART WIRELESS COMMUNICATION MODULES

Murata’s latest wireless module utilizes Wi-Fi 6E & Bluetooth 5.3 to deliver enhanced performance for IoT implementations.

Read more…

26 {{ "2023-07-26T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-26T00:00:00+00:00" | date "longDate" }}

CUI Devices News

CUI Devices’ New Rotary Potentiometer Series Offers Single or Dual Gang Options

CUI Devices’ Motion & Control Group has announced the introduction of a new rotary potentiometer series offering single or dual gang models as well as dual gang options with an on-off switch.

Read more…

26 {{ "2023-07-26T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-26T00:00:00+00:00" | date "longDate" }}

Infineon News

Featuring Infineon’s enhanced Integrity Guard 32: New controller family TEGRION sets the standard for security, efficiency, performance and ease of implementation

Infineon Technologies AG announced the new TEGRION security controller family, the company’s broadest portfolio of 28 nm security controllers.

Read more…

26 {{ "2023-07-26T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-26T00:00:00+00:00" | date "longDate" }}

4most News

FIBOX HMI Protection Windows available from Foremost Electronics

Foremost Electronics, announces the availability of two new windows for protecting Human-Machine Interfaces from enclosure specialist FIBOX.

Read more…

26 {{ "2023-07-26T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-26T00:00:00+00:00" | date "longDate" }}

ANSYS News

ANSYS 2023 R2 POWERS INDUSTRY INNOVATION WITH TRANSFORMATIVE SIMULATION TECHNOLOGIES

The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

ANSYS SIMULATION BOOSTS THE THERMAL RELIABILITY OF UPI’S POWER MANAGEMENT PRODUCTS BY 100%

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

High AI performance in a tiny, rugged housing

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

Infineon extends its PQFN 2x2 mm² product portfolio with best-in-class OptiMOS power MOSFETs

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

Mouser introduces u-blox ZED-F9P-GNSS module for autonomous vehicles and robotics

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

MESH NETWORKS AS EASY AS NEVER BEFORE

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

MURATA EXPANDS ITS RANGE OF STATE-OF-THE-ART WIRELESS COMMUNICATION MODULES

Murata’s latest wireless module utilizes Wi-Fi 6E & Bluetooth 5.3 to deliver enhanced performance for IoT implementations.

CUI Devices’ New Rotary Potentiometer Series Offers Single or Dual Gang Options

CUI Devices’ Motion & Control Group has announced the introduction of a new rotary potentiometer series offering single or dual gang models as well as dual gang options with an on-off switch.

Featuring Infineon’s enhanced Integrity Guard 32: New controller family TEGRION sets the standard for security, efficiency, performance and ease of implementation

Infineon Technologies AG announced the new TEGRION security controller family, the company’s broadest portfolio of 28 nm security controllers.

FIBOX HMI Protection Windows available from Foremost Electronics

Foremost Electronics, announces the availability of two new windows for protecting Human-Machine Interfaces from enclosure specialist FIBOX.

ANSYS 2023 R2 POWERS INDUSTRY INNOVATION WITH TRANSFORMATIVE SIMULATION TECHNOLOGIES

The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

International

Technical Articles

Case studies

White Paper

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

Murata’s latest wireless module utilizes Wi-Fi 6E & Bluetooth 5.3 to deliver enhanced performance for IoT implementations.

CUI Devices’ Motion & Control Group has announced the introduction of a new rotary potentiometer series offering single or dual gang models as well as dual gang options with an on-off switch.

Infineon Technologies AG announced the new TEGRION security controller family, the company’s broadest portfolio of 28 nm security controllers.

Foremost Electronics, announces the availability of two new windows for protecting Human-Machine Interfaces from enclosure specialist FIBOX.

The new release expands digital engineering solutions with leading solvers and large-scale computing in connected workflows.

International

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.