CEA-Leti researchers have demonstrated that electrons and other charge carriers can move faster in germanium tin, enabling lower operation voltages and smaller footprints in vertical transistors.
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced its successful completion of acquiring Panthronics AG (“Panthronics”), a fabless semiconductor company specializing in high-performance wireless products.
Exxelia, a leading designer and manufacturer of high-performance passive components and subsystems, will be showcasing its latest technological innovations at Paris Air Show (SIAE- Le Bourget) in Paris, France, from June 19 to 25. The show will highlight innovations around the aviation of the future through the reduction of the weight and size of components, as well as in other sectors such as space.
The field-programmable gate array is the first with PCIe 5.0 and CXL capabilities and the only FPGA with hard intellectual property supporting these interfaces.
Kontron and Connectivity solutions have announced its collaboration with ThinKom to demonstrate and make readily available a highly flexible Ka-band SATCOM solution to the avionics market.
Moxa Inc., a leader in industrial communications and networking, announced today that it has joined Avnu Alliance, the industry forum driving deterministic capabilities into open, standards-based networking as a promoter member to advance time-sensitive networking (TSN) ecosystem interoperability.
Automated testing software provides insightful analytics to improve sensor design and performance while accelerating testing to support volume sensor production.
The chip's new structure is expected to help downsize railway traction systems, etc. as well as make them more energy efficient, and contribute to carbon neutrality through the increased adoption of DC power transmission.