09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-09T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Teledyne Flir OEM

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Integrated Graphene News

Humans to provide energy source for smart devices of the future

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Expands Range of Wireless Connectivity Products

Wireless connectivity is essential for various technologies, including automotive positioning and satellite-based IoT for remote assets, enabling robust communication and remote applications.

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Infineon News

Automotive motor control: New MOTIX MCU embedded power IC-families with CAN FD interface provide faster communication and higher performance

Infineon Technologies AG introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX MCU embedded power ICs.

Read more…

08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-08T00:00:00+00:00" | date "longDate" }}

Leuze

Leuze announces a change of management

Leuze is placing its strong growth on a broader footing and has expanded its executive management. Xavier Hamers joined the company on April 1, 2023.

Read more…

07 {{ "2023-08-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-07T00:00:00+00:00" | date "longDate" }}

Intelliconnect News

Intelliconnect exhibiting at European Microwave Week 2023

Intelliconnect will exhibit at the 26th European Microwave Week (EuMW 2023) in Berlin, continuing the successful series since 1998.

Read more…

07 {{ "2023-08-07T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-07T00:00:00+00:00" | date "longDate" }}

Mouser News

Bosch's BHI360 Smart Sensor, Now at Mouser, Offers High Precision and Low Latency for Wearable and Smartphone Applications

Mouser Electronics the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the BHI360 programmable inertial measurement unit (IMU) smart sensor from Bosch.

Read more…

04 {{ "2023-08-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-04T00:00:00+00:00" | date "longDate" }}

VVDN News

VVDN launches end to end Private 5G Solution for Enterprises for SI, OEMs, Telcos

VVDN offers a Private 5G solution with indigenously designed ORAN Radio Units, CU/DU, and 5G Core, fully developed, integrated, and tested.

Read more…

04 {{ "2023-08-04T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-08-04T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Rutronik's KEMET R41B series provides steady EMI suppression performance

The capacitors have voltage ratings of 350 VAC and 1500 VDC, and have passed 1,000 hours of operation in accelerated THB tests at 85°C and 85% humidity.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

Humans to provide energy source for smart devices of the future

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

Mouser Expands Range of Wireless Connectivity Products

Wireless connectivity is essential for various technologies, including automotive positioning and satellite-based IoT for remote assets, enabling robust communication and remote applications.

Automotive motor control: New MOTIX MCU embedded power IC-families with CAN FD interface provide faster communication and higher performance

Infineon Technologies AG introduces the TLE988x and TLE989x families extending the company’s comprehensive and proven portfolio of MOTIX MCU embedded power ICs.

Leuze announces a change of management

Leuze is placing its strong growth on a broader footing and has expanded its executive management. Xavier Hamers joined the company on April 1, 2023.

Intelliconnect exhibiting at European Microwave Week 2023

Intelliconnect will exhibit at the 26th European Microwave Week (EuMW 2023) in Berlin, continuing the successful series since 1998.

Bosch's BHI360 Smart Sensor, Now at Mouser, Offers High Precision and Low Latency for Wearable and Smartphone Applications

Mouser Electronics the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the BHI360 programmable inertial measurement unit (IMU) smart sensor from Bosch.

VVDN launches end to end Private 5G Solution for Enterprises for SI, OEMs, Telcos

VVDN offers a Private 5G solution with indigenously designed ORAN Radio Units, CU/DU, and 5G Core, fully developed, integrated, and tested.

Rutronik's KEMET R41B series provides steady EMI suppression performance

The capacitors have voltage ratings of 350 VAC and 1500 VDC, and have passed 1,000 hours of operation in accelerated THB tests at 85°C and 85% humidity.

International