11 {{ "2023-11-11T00:00:00+00:00" | date "MMM" }} '23

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Toshiba News

Toshiba enhances range of 600V-rated IPDs for BLDC motor drive

Toshiba Electronics Europe GmbH (“Toshiba”) has extended its range of intelligent power devices (IPD) for brushless DC (BLDC) motor drive applications.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

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Fraunhofer News

Fraunhofer Leading edge semiconductor research on 200/300 mm wafers

Located in the heart of Silicon Saxony, Fraunhofer Institute for Photonic Microsystems IPMS offers both large chip manufacturers and smaller companies access to the latest research results and technologies.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

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Kontron News

Kontron SMARTCASE™ S501 Kit Solution for Mini-STX Motherboards K3921-N and K3921-H

Ultra-compact chassis kit solution for (semi-)industrial applications.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-10T00:00:00+00:00" | date "longDate" }}

Pickering News

New high voltage SMD reed relays on show at Productronica 2023

Visit stand #452 in Hall A1 at Productronica in Munich, Germany from November 14–17, 2023.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-10T00:00:00+00:00" | date "longDate" }}

Anritsu News

RanLOS and Anritsu Unveil Innovative 5G Vehicle OTA Test Solution

Versatile and cost-effective antenna OTA test solution designed for seamless integration with existing EMC chambers.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

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Rutronik Info

650 V Gen 3 Power Merged PIN SiC Schottky Diode from Vishay

Rutronik's diode range is now extended by the 3rd generation 650 V SiC diodes in Merged PIN Schottky design and 4 A – 40 A from Vishay.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon extends its ISOFACE™ product portfolio with quad-channel digital isolators for industrial and automotive applications

Modern electronic systems in automotive and industrial applications require robust, efficient, and precise data communication capabilities to ensure optimal performance.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-10T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL, VERIZON DEMONSTRATE INDUSTRY LEADING VRAN SOLUTION

Intel and Verizon completed the industry’s first data session on Intel’s 4th Gen Intel^® Xeon^® Scalable processors with Intel^® vRAN Boost on Samsung’s virtual radio access network (vRAN) solution.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-10T00:00:00+00:00" | date "longDate" }}

Micron News

MICRON PRESENTS MONOLITHIC 32GB DRAM

Micron’s advanced 1β technology-based DRAM with speeds capable of up to 8000 MT/s provides improved solutions for memory-intensive applications like generative AI.

Read more…

10 {{ "2023-11-10T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-11-10T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMICROELECTRONICS’ NEW GENERATION NFC CONTROLLER FOR STPAY-MOBILE DIGITAL-WALLET SERVICES

The ST54L combined NFC controller and secure element IC enables mobile devices like to access security-protected contactless ticketing and payment services through the STPay-Mobile platform.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Toshiba enhances range of 600V-rated IPDs for BLDC motor drive

Toshiba Electronics Europe GmbH (“Toshiba”) has extended its range of intelligent power devices (IPD) for brushless DC (BLDC) motor drive applications.

Fraunhofer Leading edge semiconductor research on 200/300 mm wafers

Located in the heart of Silicon Saxony, Fraunhofer Institute for Photonic Microsystems IPMS offers both large chip manufacturers and smaller companies access to the latest research results and technologies.

Kontron SMARTCASE™ S501 Kit Solution for Mini-STX Motherboards K3921-N and K3921-H

Ultra-compact chassis kit solution for (semi-)industrial applications.

New high voltage SMD reed relays on show at Productronica 2023

Visit stand #452 in Hall A1 at Productronica in Munich, Germany from November 14–17, 2023.

RanLOS and Anritsu Unveil Innovative 5G Vehicle OTA Test Solution

Versatile and cost-effective antenna OTA test solution designed for seamless integration with existing EMC chambers.

650 V Gen 3 Power Merged PIN SiC Schottky Diode from Vishay

Rutronik's diode range is now extended by the 3rd generation 650 V SiC diodes in Merged PIN Schottky design and 4 A – 40 A from Vishay.

Infineon extends its ISOFACE™ product portfolio with quad-channel digital isolators for industrial and automotive applications

Modern electronic systems in automotive and industrial applications require robust, efficient, and precise data communication capabilities to ensure optimal performance.

INTEL, VERIZON DEMONSTRATE INDUSTRY LEADING VRAN SOLUTION

Intel and Verizon completed the industry’s first data session on Intel’s 4th Gen Intel^® Xeon^® Scalable processors with Intel^® vRAN Boost on Samsung’s virtual radio access network (vRAN) solution.

MICRON PRESENTS MONOLITHIC 32GB DRAM

Micron’s advanced 1β technology-based DRAM with speeds capable of up to 8000 MT/s provides improved solutions for memory-intensive applications like generative AI.

STMICROELECTRONICS’ NEW GENERATION NFC CONTROLLER FOR STPAY-MOBILE DIGITAL-WALLET SERVICES

The ST54L combined NFC controller and secure element IC enables mobile devices like to access security-protected contactless ticketing and payment services through the STPay-Mobile platform.

International

Market Overview

Technical Articles

Case studies

Toshiba Electronics Europe GmbH (“Toshiba”) has extended its range of intelligent power devices (IPD) for brushless DC (BLDC) motor drive applications.

Located in the heart of Silicon Saxony, Fraunhofer Institute for Photonic Microsystems IPMS offers both large chip manufacturers and smaller companies access to the latest research results and technologies.

Ultra-compact chassis kit solution for (semi-)industrial applications.

Visit stand #452 in Hall A1 at Productronica in Munich, Germany from November 14–17, 2023.

Versatile and cost-effective antenna OTA test solution designed for seamless integration with existing EMC chambers.

Rutronik's diode range is now extended by the 3rd generation 650 V SiC diodes in Merged PIN Schottky design and 4 A – 40 A from Vishay.

Modern electronic systems in automotive and industrial applications require robust, efficient, and precise data communication capabilities to ensure optimal performance.

Intel and Verizon completed the industry’s first data session on Intel’s 4th Gen Intel® Xeon® Scalable processors with Intel® vRAN Boost on Samsung’s virtual radio access network (vRAN) solution.

Micron’s advanced 1β technology-based DRAM with speeds capable of up to 8000 MT/s provides improved solutions for memory-intensive applications like generative AI.

The ST54L combined NFC controller and secure element IC enables mobile devices like to access security-protected contactless ticketing and payment services through the STPay-Mobile platform.

International

Intel and Verizon completed the industry’s first data session on Intel’s 4th Gen Intel^® Xeon^® Scalable processors with Intel^® vRAN Boost on Samsung’s virtual radio access network (vRAN) solution.