11
'23
Written on
Infineon News
10
'23
Written on
Antaira News
Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications
Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.
10
'23
Written on
Thinesolutions News
THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500
The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.
10
'23
Written on
FEIG news
FEIG INTRODUCES NEW RFID HYBRID READER MODULE
With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.
09
'23
Written on
Inova Semiconductors News
Inova Semiconductors is going to use Samsung Foundry Services for ISELED products
Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.
09
'23
Written on
TDK News
TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY
Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.
09
'23
Written on
SK Hynix News
SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND
The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .
08
'23
Written on
Teledyne Flir OEM
Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators
A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.
08
'23
Written on
Integrated Graphene News
Humans to provide energy source for smart devices of the future
Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.
08
'23
Written on
Mouser News
