STMicroelectronics has developed two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers.
FTA 5180 is a high-end networking appliance in 1U rackmount form factor for edge computing applications. With Intel® Xeon® D-1700 LCC processor inside, it provides impeccable performance and enables 10 high-bandwidth interfaces for speedy connections.
The focus is on components from the areas of displays, boards & systems, wireless, digital, and storage. Another highlight at the booth is the new base board RDK3 from Rutronik System Solutions, which visitors can see for the first time at embedded world 2023.
EKF Elektronik launching two new 3U CompactPCI processor boards with 11th generation Intel Core and Xeon processors at Embedded World 2023 Tiger Lake H45, Hall 1 / Booth 1-406.
The portfolio includes the DIODES DSCxxA065 series with eleven products rated at 650V (4A, 6A, 8A, and 10A) and the DIODES DSCxx120 series with eight products rated at 1200V (2A, 5A, and 10A).
With the ever-increasing threat of cyberattacks across the world, it is crucial to keep systems safe and secured from attackers, no matter the origin of the source. While keeping strong passwords and changing them frequently is one of the most efficient ways to strengthen cybersecurity, other risks remain. Systems can also be breached through connectors.
TRUMPF targets SWIR VCSEL manufacturing in state-of-the-art, high-volume production process, outstanding results of robustness and performance of long wavelength VCSELs, revolutionary VCSEL technology that enables new sensing application fields such as under-OLED sensors.
Castrol is working with RISE to support with fluid, material science and thermal management expertise which will aim to accelerate data centre innovation. Castrol ON Immersion Cooling Fluids deliver thermal management performance and high fluid stability.