01
'23
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IDS Imaging Development Systems GmbH
01
'23
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DFI
DFI Presents in-Vehicle T-Box with Cybersecurity Solution VC900-M8M, Creates New Smart Fleet Management Applications
DFI, the global leader in embedded motherboards and industrial computers, aims at the smart transportation industry and launches their new low-power, energy-saving vehicle system, VC900-M8M, with the NXP I.MX8M processor.
31
'23
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Flex Power Modules News
Flex Power Modules extends DC/DC series to include telecom input range
Flex Power Modules has added a new part to their popular BMR492 series which now features a wide 36-75 V input range for telecom/PoE applications.
31
'23
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Heidenhain News
Inductive rotary encoders for robot axes: Intelligent encoders
Robotics and other applications with compact motors stand to benefit from the KCI 1300 (singleturn) and KBI 1300 (multiturn) rotary encoders from HEIDENHAIN.
31
'23
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Renesas News
Renesas Expands Motor Control Embedded Processing Portfolio with 35 New MCUs
Renesas is introducing 35 new products, including MCUs, analog and power solutions, sensors, communications devices, signal conditioners, and more, to expand its motor control portfolio.
31
'23
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NXP News
NXP's i.MX 91 Family expands Linux capabilities for edge applications
The newest member of the i.MX 9 series streamlines the development of cost-optimized edge devices that require security, performance, and Linux support in a scalable, reliable platform.
31
'23
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ams OSRAM News
ams OSRAM adds reliable, built-in eye safety feature in latest IR VCSEL emitter for in-cabin sensing applications
ams OSRAM a global leader in optical solutions, has enhanced its portfolio of infrared laser modules for automotive in-cabin sensing with the TARA2000-AUT-SAFE vertical-cavity surface-emitting laser (VCSEL) family, which offers a more reliable and robust eye safety feature than existing automotive VCSEL modules.
31
'23
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SK Hynix News
SK HYNIX ENTERS INDUSTRY’S FIRST COMPATIBILITY VALIDATION PROCESS FOR 1BNM DDR5 SERVER DRAM
The new product offers the fastest operating speed in DDR5 history, ultra-low power consumption with the adoption of HKMG process.
30
'23
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BenQ
Seven low-carbon, energy-saving sustainability ‘smart fields’ to be showcased by BenQ Group at COMPUTEX 2023 in collaboration with 22 group companies
COMPUTEX 2023, one of the top three global information and communication exhibitions, will run from May 30 to June 2 and as a leader in smart solutions.
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Mouser News
