12 {{ "2023-01-12T00:00:00+00:00" | date "MMM" }} '23

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Nexcom News

NEXCOM's NSA 7160: Level Up Ethernet Connectivity with High-Performance Network Appliance

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel^® Xeon^® Scalable processor, the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM’s well-established cyber security product line.

Read more…

12 {{ "2023-01-12T00:00:00+00:00" | date "MMM" }} '23

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Kamic Group News

KAMIC Group acquires Avon Magnetics, a leading British manufacturer of wound magnetic components

KAMIC Group has acquired, through its subsidiary ETAL (UK) Ltd, all the shares in Avon Magnetics Ltd, The sellers are John and Lynn Anderson.

Read more…

12 {{ "2023-01-12T00:00:00+00:00" | date "MMM" }} '23

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Allied Electronics & Automation News

Allied Electronics & Automation Offers Phoenix Contact’s New XTV Terminal Blocks With Push-X Direct Connection Technology

The new XTV terminal blocks are the first product on the market to incorporate Phoenix Contact’s breakthrough Push-X connection technology, which allows them to terminate conductors with cross sections extending from 6mm2 to 16mm2 quickly, easily, reliably, and almost effortlessly.

Read more…

12 {{ "2023-01-12T00:00:00+00:00" | date "MMM" }} '23

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TDK News

Compact 70W and 160W external AC-DC power adapters suit medical and industrial applications

TDK Corporation announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W.

Read more…

12 {{ "2023-01-12T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-12T00:00:00+00:00" | date "longDate" }}

Perle Systems News

Perle IRG7440 5G Router is Certified as Orange Assessed

Orange’s IoT Journey Partnership Program tests devices to validate functionality and ease of connection to the Orange network.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-11T00:00:00+00:00" | date "longDate" }}

Kontron News

COMH-CARP AND COMH-CCAS: KONTRON ADVANCES INDUSTRIAL HIGH-PERFORMANCE COMPUTING

Kontron introduces two COM-HPC^® Clients, COMh-caRP and COMh-ccAS, based on 13th Gen Intel^® Core processors mobile and desktop version. They offer a significant increase in performance compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel^® performance hybrid architecture.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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Keysight technologies News

Keysight Coordinates Pan-European 6G Testbed

The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-11T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross

Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.

Read more…

11 {{ "2023-01-11T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-11T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles

ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.

Read more…

Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

NEXCOM's NSA 7160: Level Up Ethernet Connectivity with High-Performance Network Appliance

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel^® Xeon^® Scalable processor, the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM’s well-established cyber security product line.

KAMIC Group acquires Avon Magnetics, a leading British manufacturer of wound magnetic components

KAMIC Group has acquired, through its subsidiary ETAL (UK) Ltd, all the shares in Avon Magnetics Ltd, The sellers are John and Lynn Anderson.

Allied Electronics & Automation Offers Phoenix Contact’s New XTV Terminal Blocks With Push-X Direct Connection Technology

The new XTV terminal blocks are the first product on the market to incorporate Phoenix Contact’s breakthrough Push-X connection technology, which allows them to terminate conductors with cross sections extending from 6mm2 to 16mm2 quickly, easily, reliably, and almost effortlessly.

Compact 70W and 160W external AC-DC power adapters suit medical and industrial applications

TDK Corporation announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W.

Perle IRG7440 5G Router is Certified as Orange Assessed

Orange’s IoT Journey Partnership Program tests devices to validate functionality and ease of connection to the Orange network.

COMH-CARP AND COMH-CCAS: KONTRON ADVANCES INDUSTRIAL HIGH-PERFORMANCE COMPUTING

Keysight Coordinates Pan-European 6G Testbed

The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.

TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.

Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross

Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.

ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles

ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.

International

Case studies

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel® Xeon® Scalable processor, the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM’s well-established cyber security product line.

KAMIC Group has acquired, through its subsidiary ETAL (UK) Ltd, all the shares in Avon Magnetics Ltd, The sellers are John and Lynn Anderson.

The new XTV terminal blocks are the first product on the market to incorporate Phoenix Contact’s breakthrough Push-X connection technology, which allows them to terminate conductors with cross sections extending from 6mm2 to 16mm2 quickly, easily, reliably, and almost effortlessly.

TDK Corporation announces the addition of the TDK-Lambda brand DTM70 and DTM160 series to the DTM family of compact medical and industrial AC-DC power adapters that are available in various power classes from 36W to 300W.

Orange’s IoT Journey Partnership Program tests devices to validate functionality and ease of connection to the Orange network.

The company joins forces with sixteen organizations to create 6G-SANDBOX, a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator.

TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.

Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.

ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.

International

NEXCOM, a leading supplier of network appliances, launched a new platform based on the 4th Gen Intel^® Xeon^® Scalable processor, the NSA 7160. This high-performance 2U rackmount is a long-awaited enhancement of NEXCOM’s well-established cyber security product line.