09
'22
Written on
Digi-Key News
09
'22
Written on
Toshiba News
Toshiba’s young engineers: The ability to listen and think drives innovation
Remote work has become the new normal due to the COVID-19 pandemic. Some people use the time freed up from commuting to enrich their private lives, while others use it to study, as an investment in their future selves.
09
'22
Written on
TDK News
40W and 60W 2” x 1” DC-DC converters have a 4:1 input range and six-sided shielding
TDK Corporation announces the introduction of the TDK-Lambda brand PXD40 and PXD60 series of 40 and 60W DC-DC converters. Packaged in the industry-standard 2” x 1” footprint, the units can operate over a wide 4:1 input range, accepting either a 9 to 36Vdc or 18 to 75Vdc input. Operation from 12V and 24V or 24V and 48V supply voltages reduces inventory carrying costs and improves part availability.
09
'22
Written on
TDK News
Inductors TDK offers compact inductors with enhanced performance capabilities to address smartphone power circuit demands
TDK Corporation has developed the new TFM201208BLE series of inductors optimized for space-constrained smartphone power circuits. These are available in 0.24, 0.33 and 0.47 µH versions. Mass production will begin in June 2022.
09
'22
Written on
Infineon News
“Building new Connections:” Infineon links digital to the real world with new decarbonization and IoT solutions at EW Nuremberg 2022
Infineon Technologies AG today announced plans to highlight how it links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and homes, smart factories and smart mobility, along with its latest software and tools for system builders and makers working across the electronics industry.
09
'22
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CEVA News
CEVA Bluetooth® 5.3 Platform IP Supports New Auracast Broadcast Audio, Transforming the Shared Audio Experience
Auracast broadcast audio unveiled by Bluetooth SIG enables single audio source Auracast transmitter device to broadcast one or more audio streams to multiple Auracast receiver devices.
09
'22
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ANSYS News
Ansys Significantly Increases Speed and Capacity of Semiconductor Signoff with Massively Scalable SeaScape Platform
New products Ansys® Totem-SC and Ansys® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.
09
'22
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ST News
STMicroelectronics’ newest NFC readers accelerate payment and consumer application designs
STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price.
08
'22
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ST News
STMicroelectronics’ flexible high-voltage op amp targets automotive and industrial environments
The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.
08
'22
Written on
Qualcomm News
