06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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CEVA News

CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution

CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, has announced that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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U Blox News

U-blox LTE-M module fully certified in Japan

U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Renesas News

Renesas Announces Its First Wi-Fi Development Kit with Support for New Matter Protocol

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth^® Low-Energy and IEEE 802.15.4 (Thread) products, including products from recently acquired Dialog Semiconductor and Celeno Communications.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Anritsu News

Anritsu Field Master Pro MS2090A Wins Fierce Innovation Award, Telecom Edition in T&M Category

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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IAR Systems News

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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ONSEMI News

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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NXP News

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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ams OSRAM News

Quadric and ams OSRAM collaborate to bring intelligent image sensors’ demonstration

Quadric, an innovator in machine learning processor IP for on-device AI, and ams OSRAM, a global leader in optical solutions, today announced a strategic collaboration to develop integrated sensing modules combining ams OSRAM’s leading edge Mira Family of CMOS sensors for visible and infrared with Quadric’s novel ChimeraTM GPNPU processors.

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Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution

U-blox LTE-M module fully certified in Japan

U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.

Renesas Announces Its First Wi-Fi Development Kit with Support for New Matter Protocol

Anritsu Field Master Pro MS2090A Wins Fierce Innovation Award, Telecom Edition in T&M Category

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

Quadric and ams OSRAM collaborate to bring intelligent image sensors’ demonstration

International

Case studies

U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.

Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.

TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.

IAR Systems®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

Onsemi’s EliteSiC family of silicon carbide (SiC) technologies enhances performance of Ampt’s DC optimizers.

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

International

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.