01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

Infineon News

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

TDK News

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

Read more…

01 {{ "2023-05-01T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-05-01T00:00:00+00:00" | date "longDate" }}

ANSYS News

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Rutronik Info

Base for high-end-computing: New Intel^® Xeon^® W-3400 and Intel^® Xeon^® W-2400 processor family at Rutronik

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Nexperia News

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

Read more…

28 {{ "2023-04-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-28T00:00:00+00:00" | date "longDate" }}

Arkema News

ARKEMA EXTENDS ITS SUITE OF ADVANCED “INSIDE THE CELL” SOLUTIONS

Arkema has launched the Incellion range of sustainable waterborne acrylic solutions for high-capacity anodes, cathode primers and ceramic coated separators.

Read more…

27 {{ "2023-04-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-27T00:00:00+00:00" | date "longDate" }}

Mouser News

Establishing an Ethical Framework for Autonomous Vehicles

By Mark Patrick, Mouser Electronics.

Read more…

27 {{ "2023-04-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-27T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

FRAUNHOFER PRESENTS HIGH-PRECISION MICROSENSOR TECHNOLOGY FOR A WIDE APPLICATION RANGE

Developing pioneering technology solutions and bringing them into application - that is the goal of Fraunhofer Institute for Photonic Microsystems IPMS.

Read more…

27 {{ "2023-04-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-04-27T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs

Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

New EiceDRIVER 1200 V half-bridge driver IC family with active Miller clamp for optimized ruggedness in high power systems

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

TDK TO SHOWCASE LATEST INNOVATIONS AT SENSOR+TEST AND PCIM

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

TSMC CERTIFIES ANSYS MULTIPHYSICS SOLUTIONS FOR N2 SILICON PROCESS

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

Base for high-end-computing: New Intel^® Xeon^® W-3400 and Intel^® Xeon^® W-2400 processor family at Rutronik

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

NEXPERIA INTRODUCES THE BEST-IN-CLASS PORTFOLIO OF I2C GPIO EXPANDERS

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

ARKEMA EXTENDS ITS SUITE OF ADVANCED “INSIDE THE CELL” SOLUTIONS

Arkema has launched the Incellion range of sustainable waterborne acrylic solutions for high-capacity anodes, cathode primers and ceramic coated separators.

Establishing an Ethical Framework for Autonomous Vehicles

By Mark Patrick, Mouser Electronics.

FRAUNHOFER PRESENTS HIGH-PRECISION MICROSENSOR TECHNOLOGY FOR A WIDE APPLICATION RANGE

Developing pioneering technology solutions and bringing them into application - that is the goal of Fraunhofer Institute for Photonic Microsystems IPMS.

Partnership for True Multiple Sourcing: Semikron Danfoss Power Modules with ROHM IGBTs

Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.

International

Technical Articles

Case studies

White Paper

Following the introduction of the EiceDRIVER 6ED223xS12T 1200 V Silicon-on-Isolator (SOI) 3-phase gate driver family, Infineon Technologies AG is now expanding its portfolio with the EiceDRIVER 2ED132xS12x family.

Sensor+Test and PCIM take place from May 9 to 11 in parallel in the Exhibition Center Nuremberg, Germany. TDK is represented at Sensor+Test at booth 204 in hall 1 and at PCIM at booth 348 in hall 9.

Ansys is certified for TSMC’s N2 process, including thermal self-heat effects for greater chip reliability and more optimized designs.

With the Intel® Xeon® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.

Infineon Technologies AG and Schweizer Electronic AG (ETR: SCE) are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC).

The portfolio provides an elegant solution when additional I/Os are needed while keeping the interconnections to a minimum.

Arkema has launched the Incellion range of sustainable waterborne acrylic solutions for high-capacity anodes, cathode primers and ceramic coated separators.

By Mark Patrick, Mouser Electronics.

Developing pioneering technology solutions and bringing them into application - that is the goal of Fraunhofer Institute for Photonic Microsystems IPMS.

Semikron Danfoss and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.

International

With the Intel^® Xeon^® W-3400 and W-2400 (code-named Sapphire Rapids), Rutronik Elektronische Bauelemente GmbH is adding new desktop workstation processors to its range that are predestined for high-end computing.