16
'23
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U Blox News
16
'23
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Renesas News
Renesas Expands RA MCU Family with Two New Entry-Line Groups Offering Optimal Combination of Performance, Features and Value
New RA4E2 and RA6E2 MCUs Deliver High Performance up to 200 MHz in Compact Packages with Rich Peripheral Options.
16
'23
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Infineon News
Efficient and high-performing vehicle architecture: Cooperation of Continental and Infineon
Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures.
16
'23
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TDK News
TDK DEVELOPS INDUCTORS FOR INDUSTRIAL SINGLE PAIR ETHERNET (SPE)
TDK has developed a series of inductors for Industrial Single Pair Ethernet (SPE) based on the IEEE 802.3cg standard for 10BASE-T1L.
16
'23
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AMD News
AMD ANNOUNCES NEW EPYC EMBEDDED 9004 SERIES
The new energy-efficient EPYC Embedded 9004 Series combines embedded system-optimized features, enhanced security and scalability of up to 96 cores.
16
'23
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Silicon Labs News
SILICON LABS ANNOUNCES NEW SOC AND MCU FOR SMALL FORM-FACTOR DEVICES
The xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU) are ideal for the smallest form factor IoT devices.
15
'23
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Congatec News
CONGATEC ADDS TI PROCESSORS TO ITS STRATEGIC SOLUTIONS PORTFOLIO
congatec is pleased to announce that it is expanding its strategic solutions portfolio in the Arm processor sector to include Texas Instruments (TI) processors.
15
'23
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ONSEMI News
onsemi extends Bluetooth Low Energy MCU Family for Automotive Wireless Applications
NCV-RSL15 combines the industry’s lowest power consumption and latest in embedded security for vehicle access, tire monitoring and more.
15
'23
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Fraunhofer News
FRAUNHOFER EMBEDDED SYSTEMS: LOOKING AHEAD TO THE FUTURE WITH AI AND SUSTAINABILITY
Fraunhofer IZM’s plug-and-play sensor platforms enable rapid testing and validation of concept ideas for wireless sensor and radar sensor systems.
15
'23
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DFI
