09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

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Leuze

Leuze promotes "integrated connectivity" concept

Increased efficiency, improved commissioning, machine monitoring and process optimisation.

Read more…

09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-09T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Photonics and Ayar Labs Collaborate to Support Next Generation Network Technology at OFC 2023

CW-WDM MSA Compliant DFB Laser Arrays and SuperNova Remote Optical Source Support AI Connections, Disaggregated Data Centers, 6G, and Phased Array Sensory Systems.

Read more…

09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser Electronics and Kingston Technology Expand North American Distribution Deal to Europe

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, announces an expansion to the distribution agreement with Kingston Technology Europe Co LLP, a world leader in memory products and technology solutions.

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09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

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OMRON News

New Omron AC PCB Relay Delivers Its Highest Load Capacity

Omron Electronic Components Europe has extended its AC relay portfolio to provide its highest ever current and voltage capacity for AC PCB relays. The new G9KA-E operates with voltage capacity up to 1000VAC, and current up to 300A – one of the highest specifications in the current PCB relay market.

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09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon and UMC extend automotive partnership with long-term agreement for 40nm eNVM microcontroller production

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

Read more…

09 {{ "2023-03-09T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-09T00:00:00+00:00" | date "longDate" }}

ST News

STMICROELECTRONICS DEVELOPS ALL-IN-ONE MOTION AND BONE-CONDUCTION SENSOR

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Takes Developer Experience to the Next Level with New MCUXpresso Tools

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk is Presenting the AIoT Solutions at Embedded World 2023

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon AIROC CYW43022 Wi-Fi 5 and Bluetooth^® combo extends battery life for IoT applications with up to 65 percent power reduction

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

Read more…

08 {{ "2023-03-08T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-08T00:00:00+00:00" | date "longDate" }}

Celus News

CELUS Opens New Platform for Beta Testing

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

Leuze promotes "integrated connectivity" concept

Increased efficiency, improved commissioning, machine monitoring and process optimisation.

Sivers Photonics and Ayar Labs Collaborate to Support Next Generation Network Technology at OFC 2023

CW-WDM MSA Compliant DFB Laser Arrays and SuperNova Remote Optical Source Support AI Connections, Disaggregated Data Centers, 6G, and Phased Array Sensory Systems.

Mouser Electronics and Kingston Technology Expand North American Distribution Deal to Europe

New Omron AC PCB Relay Delivers Its Highest Load Capacity

Infineon and UMC extend automotive partnership with long-term agreement for 40nm eNVM microcontroller production

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

STMICROELECTRONICS DEVELOPS ALL-IN-ONE MOTION AND BONE-CONDUCTION SENSOR

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

NXP Takes Developer Experience to the Next Level with New MCUXpresso Tools

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Innodisk is Presenting the AIoT Solutions at Embedded World 2023

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Infineon AIROC CYW43022 Wi-Fi 5 and Bluetooth^® combo extends battery life for IoT applications with up to 65 percent power reduction

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

CELUS Opens New Platform for Beta Testing

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

International

Technical Articles

Case studies

White Paper

Increased efficiency, improved commissioning, machine monitoring and process optimisation.

CW-WDM MSA Compliant DFB Laser Arrays and SuperNova Remote Optical Source Support AI Connections, Disaggregated Data Centers, 6G, and Phased Array Sensory Systems.

Infineon Technologies AG and United Microelectronics Corporation (“UMC”) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon automotive microcontroller in order to serve the rapidly expanding automotive market.

The unique highly integrated sensor delivers longer listening experience and superior hearing in TWS headphones and AR/VR/MR headsets.

A new generation of MCUXpresso tools streamlines embedded software development, enabling open-source projects, simplified access to specialist middleware and hardware abstraction across NXP's wide range of MCUs.

Moving towards the post-pandemic recovery, Innodisk has proactively expanded its overseas markets. To demonstrate its commitment to AIoT strategic development, Innodisk announced its participation at Embedded World 2023.

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.

The new platform which is expected to be released this spring is giving electronics designers the opportunity to pioneer the software, receive first-hand training from CELUS, and access the private beta community.

International

Infineon Technologies AG today announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth^® combo, extending its broad portfolio of existing AIROC Wi-Fi and Bluetooth products.