11
'23
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Keysight technologies News
11
'23
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TDK News
TDK announces SmartBug 2.0 - A smarter digital transformation module with Machine Learning-Enabled ICM-45686-S IMU
TDK Corporation announces the InvenSense SmartBug 2.0 with various new and exciting features for consumer and IoT applications as a smart remote data-collection module for IoT after the success of the original SmartBug.
11
'23
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Infineon News
Infineon Technologies increases focus and investment into core semiconductor development for high-reliability markets; sells HiRel DC-DC converter business to Micross
Infineon Technologies AG today announced that Micross Components, Inc. (“Micross”) has entered a definitive agreement to purchase Infineon’s HiRel DC-DC converter business including its hybrid and custom board-based power products.
11
'23
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Rohm Semiconductors News
ROHM’s 4th Generation SiC MOSFETs to be Used in Hitachi Astemo’s Inverters for Electric Vehicles
ROHM has recently announced the adoption of its new 4th Generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd, a leading Japanese automotive parts manufacturer.
11
'23
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CUI Devices News
CUI Devices Adds New Potentiometers Product Line
CUI Devices’ Motion and Control Group has announced the addition of a new line of potentiometers. Available in shaft or shaftless options, these rotary potentiometers feature resistance ratings from 1 to 2000 kΩ and panel mount or through hole mounting styles.
11
'23
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Review Displays News
High performance single board computer designed for graphics intensive tasks
Embedded systems and display solutions provider, Review Display Systems Inc, has announced the introduction of an AMD-powered mini-STX single board computer from leading global provider of embedded technology, Kontron.
10
'23
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ST News
STPOWER automotive-grade devices from STMicroelectronics run cooler in surface-mount ACEPACK SMIT package
STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
10
'23
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TDK News
TDK redefines true wireless stereo applications with VibeSense360 solution suite
TDK Corporation expands its solution-focused offerings by announcing the InvenSense VibeSense360 TWS solution suite. VibeSense360 is a comprehensive portfolio of TDK solutions comprised of hardware and software dedicated to the TWS market.
10
'23
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Nexcom News
The In-Vehicle AI-Aided Telematics Computer, VTC 7260-xC4 Leads the Way
To cope with the boom of e-commerce and direct delivery trends, machine learning is currently greatly integrated into ADAS, public works, intelligent traffic system, and countless warehouse applications. Provided with advanced computing power, extension capability, and high connectivity, NEXCOM’s in-vehicle AI-aided telematics computer, VTC 7260-xC4 is used as the core of vehicles to help deploy applications like smart public transit, smart agriculture/construction, and automated intralogistics.
10
'23
Written on
Keysight technologies News
