19
'22
Written on
Nexcom News
19
'22
Written on
Diodes Incorporated News
Three-Level Configurable Slew-Rate Controlled Power Switch from Diodes Incorporated Simplifies and Enhances Power-Rail Management in Solid State Drives
Diodes Incorporated (Diodes) has introduced a new versatile single-channel high-side power switch. The DIODES AP22980 features three different selectable slew rates, so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability.
19
'22
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MIkroe News
New display connection open standard from MIKROE enables wide choice of display size and style, saving development resource
DISCON facilitates simple installation and replacement of any type of display on a development board.
19
'22
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CCLINK News
Industry leader HMS Networks further boosts CC-Link IE TSN development ecosystem
Anybus® CompactCom 40 CC-Link IE TSN adds to the range of development options for device vendors developing CC-Link IE TSN products.
16
'22
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Nexperia News
Nexperia announces two new additions to their TrEOS family of ESD protection devices for high-speed data lines
Combining high surge robustness with very low trigger and extremely low clamping voltages, the PESD4V0Y1BBSF and PESD4V0X2UM offer a highly effective solution for the protection of sensitive systems.
16
'22
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Keysight technologies News
Keysight Announces First and Highest Density 400GE Network Cybersecurity Test Platform
Provides network equipment manufacturers and data center operators with an extensible cybersecurity test platform that supports hyperscale data volumes, encryption demands, and security challenges.
16
'22
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Melexis News
Melexis expands its portfolio of high-speed inductive resolver ICs
Melexis is expanding its range of automotive-qualified inductive resolvers for e-motor applications (power steering, traction motor, brake booster). The MLX90517 complements the MLX90510 by providing raw signals to enable off-chip compensation in the ECU.
16
'22
Written on
Infineon News
Infineon adds PQFN Dual-Side Cooling 25-150 V portfolio to its OptiMOS Source-Down power MOSFET family
The design of future power electronic systems is continuously pushed to improve state-of-the-art performance and power density. Supporting this trend, Infineon Technologies AG launches a new Source-Down 3.3 x 3.3 mm² PQFN product family in the 25-150 V classes with Bottom-Side (BSC) and Dual-Side Cooling (DSC) variants.
16
'22
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TDK News
TDK releases ModCap HF DC link capacitors with ultra-low ESL
TDK Corporation presents ModCapTM HF, a modular capacitor concept for DC link applications that is able to work at very high switching frequencies. The six newly developed power capacitors of the B25647A* series are available for rated voltages from 900 V to 1600 V and cover a capacitance spectrum from 640 µF to 1850 µF.
16
'22
Written on
CUI Devices News
