Infineon Technologies AG has been named a CES® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.
DENSO Corporation announced it has received the IEEE Corporate Innovation Award from IEEE, the largest international association for electrical and electronic engineering in the world, for developing the QR Code and spreading its use globally.
Flex Power Modules is announcing an upgrade to the specification of their innovative BMR510, a two-phase voltage regulator module. The BMR510 now utilizes advanced materials of magnetic core, yielding high inductance in a small package size, allowing lower switching frequency operation than would be necessary with the gapped ferrite cores previously used.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, has teamed up with Microchip Technology to bring the engineering community a new webinar entitled “Cellular IoT Applications.” The free live webinar will take place at 3 p.m. Central European Time on Tuesday, 13 December 2022.
Siquance, a CEA/CNRS-inspired startup, was launched in Grenoble on the 29th of November, 2022. Co-founded and directed by Maud Vinet, Siquance aims to develop and commercialize a quantum computer built on advanced microelectronics technology and the expertise of European chip manufacturers.
The Israel Institute of Technology (Technion) recently marked the opening of the Power Electronics And Renewable Energy Laboratory (PEARL), a first of its kind laboratory integrating renewable energy and power electronics as part of the studies in the Faculty of Electrical and Computer Engineering.
Diodes Incorporated, responding to rapidly growing opportunities in pre-installed in-vehicle USB charging, has announced a highly integrated dual-channel USB Type-C® protocol decoder.
The new LS25CI throughbeam photoelectric sensor from Leuze is powerful and flexible and can transilluminate even metalised and dark films - meets the stringent requirements of the packaging industry.