TDK Corporation is pleased to announce that TDK-Lambda UK’s Power Supply Apparatus patent application has been approved for grant by the UK Intellectual Property Office. The new thermal strategy covered by the patent leads to power supplies that are flexible in their cooling requirements, keep audible noise to a minimum, and are easy for customers to integrate into their systems.
Rutronik Elektronische Bauelemente GmbH achieved a new all-time high in the logistics sector in September. Already during August, the monthly turnover of the European central warehouse of the distribution company exceeded the 100 million Euro mark for the first time. That result was exceeded once again in September, with monthly sales rising to more than 109 million Euros.
Toshiba Electronics Europe GmbH announces the MG10 Series of massive capacity 20TB HDDs with conventional magnetic recording (CMR) . The 20TB MG10 Series has a 10-disk helium-sealed design that leverages Toshiba’s innovative Flux Control Microwave Assisted Magnetic Recording (FC-MAMR) technology to boost storage capabilities.
ICsense, a TDK Group Company and independent subsidiary that focuses on the supply of application-specific integrated circuits (ASICs) and custom chip design services, has started mass production of a new chemical sensor interface ASIC.
Sivers Semiconductors AB (publ) (“Sivers”) today announces that its business unit, Sivers Wireless, and the Department of Microtechnology and Nanoscience at Chalmers University of Technology (“Chalmers”) will collaborate in research and development of a new generation of power amplifiers.
The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies and many other digital applications.
New application test automation method accelerates assessment of the quality of experience delivered by the world’s most widely used mobile applications.
NEC Corporation has been selected by the New South Wales (NSW) Telco Authority to build the initial phase of a state-of-the-art 5G innovation lab as part of a new strategic partnership.
DFI, the world’s leading brand in embedded motherboards and industrial computers, was invited to participate in “AMD Datacenter Solutions Day” in September.