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TDK News

TDK OFFERS COMPACT CERALINK® CAPACITORS IN EIA 2220 SIZE

TDK Corporation (TSE:6762) has expanded its tried-and-tested range of CeraLink capacitors. Previously, only large, ready-to-fit sizes were available. Now, smaller versions with the classic chip design are included in the portfolio in order to increase the areas of application.

Siemens digital Industry Software News

Siemens' Analog FastSPICE certified for UMC's 28nm HPCᵁ+ process technology

Siemens Digital Industries Software today announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology. With this certification, customers using Siemens‘ AFS platform can now leverage the performance enhancement and power efficiency of UMC‘s proven 28HPC U+ process for their next-generation analog/mixed-signal designs.

Qualcomm News

Leading research delivers AI firsts

At Qualcomm, we have a culture of innovation. We take pride in researching and developing fundamental technologies that will change the world. It’s also in our DNA to prototype these ideas and ensure that they can be deployable and scalable under real-world conditions. We have a saying that if you haven't tested it, it doesn't work — so we seed ideas, build prototype systems, and seeing if they are worth the effort to commercialize.

innodisk

Innodisk DDR5 Raises the Bar for Workstations

Innodisk has announced the debut of their new industrial-grade DDR5 memory in workstations, which are powerful computers intended for specialized technical and scientific use cases.

Lane Electronics News

Lane Electronics achieves renewal of JOSCAR accreditation

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, is pleased to announce their continued association with JOSCAR, the Joint Supply Chain Accreditation Register.

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