17 {{ "2023-03-17T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-17T00:00:00+00:00" | date "longDate" }}

ST News

STMICROELECTRONICS SIMPLIFIES AND ACCELERATES WIRELESS PRODUCT DEVELOPMENT

The new STM32 Bluetooth^® wireless module lets designers access the advantages of ST’s dual-core STM32WB MCUs, especially in projects intended for low-to-medium production volumes.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

ONSEMI News

onsemi Showcases Intelligent Power Technologies at APEC 2023

Highlights include the introduction of a state-of-the-art power simulator for silicon carbide and a variety of interactive demos.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

Kontron News

Robust, multi-touch Panel PCs supplied with smart software toolkit

Review Display Systems has announced the availability of a new range of high-quality multi-touch Panel PCs from leading global provider Kontron.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

NXP News

NXP’s New Secure, Connected MCU Enables Faster, More Secure NFC Authentication

Single-chip secure, connected MCU solution combines a full NFC reader, a customizable Arm^® Cortex^®- M33 MCU and a complete security toolbox to help deliver faster and more secure NFC authentication.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

U Blox News

u-blox Introduces Tri-Radio Module with Wi-Fi 6, Bluetooth LE, and Thread

The u-blox IRIS-W1 offers a powerful wireless MCU and delivers high-standard security, both features for a wide range of market segments.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Expands RA MCU Family with Two New Entry-Line Groups Offering Optimal Combination of Performance, Features and Value

New RA4E2 and RA6E2 MCUs Deliver High Performance up to 200 MHz in Compact Packages with Rich Peripheral Options.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

Infineon News

Efficient and high-performing vehicle architecture: Cooperation of Continental and Infineon

Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

TDK News

TDK DEVELOPS INDUCTORS FOR INDUSTRIAL SINGLE PAIR ETHERNET (SPE)

TDK has developed a series of inductors for Industrial Single Pair Ethernet (SPE) based on the IEEE 802.3cg standard for 10BASE-T1L.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

AMD News

AMD ANNOUNCES NEW EPYC EMBEDDED 9004 SERIES

The new energy-efficient EPYC Embedded 9004 Series combines embedded system-optimized features, enhanced security and scalability of up to 96 cores.

Read more…

16 {{ "2023-03-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-16T00:00:00+00:00" | date "longDate" }}

Silicon Labs News

SILICON LABS ANNOUNCES NEW SOC AND MCU FOR SMALL FORM-FACTOR DEVICES

The xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU) are ideal for the smallest form factor IoT devices.

Read more…

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

STMICROELECTRONICS SIMPLIFIES AND ACCELERATES WIRELESS PRODUCT DEVELOPMENT

The new STM32 Bluetooth^® wireless module lets designers access the advantages of ST’s dual-core STM32WB MCUs, especially in projects intended for low-to-medium production volumes.

onsemi Showcases Intelligent Power Technologies at APEC 2023

Highlights include the introduction of a state-of-the-art power simulator for silicon carbide and a variety of interactive demos.

Robust, multi-touch Panel PCs supplied with smart software toolkit

Review Display Systems has announced the availability of a new range of high-quality multi-touch Panel PCs from leading global provider Kontron.

NXP’s New Secure, Connected MCU Enables Faster, More Secure NFC Authentication

Single-chip secure, connected MCU solution combines a full NFC reader, a customizable Arm^® Cortex^®- M33 MCU and a complete security toolbox to help deliver faster and more secure NFC authentication.

u-blox Introduces Tri-Radio Module with Wi-Fi 6, Bluetooth LE, and Thread

The u-blox IRIS-W1 offers a powerful wireless MCU and delivers high-standard security, both features for a wide range of market segments.

Renesas Expands RA MCU Family with Two New Entry-Line Groups Offering Optimal Combination of Performance, Features and Value

New RA4E2 and RA6E2 MCUs Deliver High Performance up to 200 MHz in Compact Packages with Rich Peripheral Options.

Efficient and high-performing vehicle architecture: Cooperation of Continental and Infineon

Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures.

TDK DEVELOPS INDUCTORS FOR INDUSTRIAL SINGLE PAIR ETHERNET (SPE)

TDK has developed a series of inductors for Industrial Single Pair Ethernet (SPE) based on the IEEE 802.3cg standard for 10BASE-T1L.

AMD ANNOUNCES NEW EPYC EMBEDDED 9004 SERIES

The new energy-efficient EPYC Embedded 9004 Series combines embedded system-optimized features, enhanced security and scalability of up to 96 cores.

SILICON LABS ANNOUNCES NEW SOC AND MCU FOR SMALL FORM-FACTOR DEVICES

The xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU) are ideal for the smallest form factor IoT devices.

International

Technical Articles

Case studies

White Paper

The new STM32 Bluetooth® wireless module lets designers access the advantages of ST’s dual-core STM32WB MCUs, especially in projects intended for low-to-medium production volumes.

Highlights include the introduction of a state-of-the-art power simulator for silicon carbide and a variety of interactive demos.

Review Display Systems has announced the availability of a new range of high-quality multi-touch Panel PCs from leading global provider Kontron.

Single-chip secure, connected MCU solution combines a full NFC reader, a customizable Arm® Cortex®- M33 MCU and a complete security toolbox to help deliver faster and more secure NFC authentication.

The u-blox IRIS-W1 offers a powerful wireless MCU and delivers high-standard security, both features for a wide range of market segments.

New RA4E2 and RA6E2 MCUs Deliver High Performance up to 200 MHz in Compact Packages with Rich Peripheral Options.

Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures.

TDK has developed a series of inductors for Industrial Single Pair Ethernet (SPE) based on the IEEE 802.3cg standard for 10BASE-T1L.

The new energy-efficient EPYC Embedded 9004 Series combines embedded system-optimized features, enhanced security and scalability of up to 96 cores.

The xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU) are ideal for the smallest form factor IoT devices.

International

The new STM32 Bluetooth^® wireless module lets designers access the advantages of ST’s dual-core STM32WB MCUs, especially in projects intended for low-to-medium production volumes.

Single-chip secure, connected MCU solution combines a full NFC reader, a customizable Arm^® Cortex^®- M33 MCU and a complete security toolbox to help deliver faster and more secure NFC authentication.