22
'23
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TE Connectivity News
22
'23
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Micron News
MICRON OFFERS UFS 4.0 MOBILE STORAGE BUILT ON 232-LAYER 3D NAND
Micron’s newest mobile flash storage outpaces competition on several critical NAND benchmarks, delivering the industry’s fastest performance for flagship smartphones with fast bootup, app launches and video downloads.
21
'23
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IAR Systems News
IAR fully supports the latest TRAVEO T2G CYT6BJ Body MCU series from Infineon
With IAR Embedded Workbench for Arm, developers can take advantage of maximized performance, ensured code quality and functional safety when working with the recently introduced Infineon TRAVEO T2G Body MCU family.
21
'23
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Infineon News
Infineon’s XENSIV PAS CO2 meets the performance criteria of internationally recognized WELL and LEED green building standards
As part of the global effort for decarbonization, improving the energy efficiency of buildings is a critical part of the solution.
21
'23
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AMD News
AMD EXPANDS LEADERSHIP DATA CENTER PORTFOLIO WITH NEW EPYC CPUS
AMD is unleashing the power of specialized computing for the data center with new AMD EPYC processors for cloud native and technical computing.
20
'23
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CEA Leti News
CEA-Leti and Intel develop thin 2D TMDs using Layer Transfer Technology
CEA-Leti and Intel collaborate on developing layer transfer technology for 2D TMDs on 300mm wafers, aiming to extend Moore's Law beyond 2030.
20
'23
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Röhm News
Vitesco Technologies and ROHM have signed a long-term SiC supply partnership
Vitesco Technologies, a leading international manufacturer of modern drive technologies and electrification solutions, has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through a long-term supply partnership with ROHM – worth over one billion US dollars until 2030.
20
'23
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Fraunhofer News
Light Modulation in Perfection - Optical Microsystems of Fraunhofer IPMS
Fraunhofer Institute for Photonic Microsystems IPMS uses optical microsystems to enable fast and high-resolution light control. By using small, movable mirrors, the institute's photonic systems can modulate light to create unique images and structures.
20
'23
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Siemens News
Siemens brings real-time supply chain intelligence to Siemens Xcelerator and the digital twin
The integrated solutions provide customers with real-time visibility into global component availability, demand, cost and compliance data. Begins with integration of the Supplyframe DSI platform with Siemens’ Xpedition software for electronics systems design.
20
'23
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Teledyne Flir OEM
