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Infineon News

Infineon doubles down on wide bandgap by investing more than €2 billion in a new Kulim, Malaysia frontend fab to expand market leadership in power semiconductors

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is strengthening its market leadership in power semiconductors by adding significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors.

Infineon News

MERUS class D audio amplifier multichip module enables small footprint, high power density, and heatsink-free operation

Class D audio power amplifiers offer a combination of small size, low heat dissipation, high integration, and excellent sound quality. Unlocking the potential of its best-in-class power MOSFET technology, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the MERUS 2-channel, analog input, class D audio amplifier multichip module (MCM) MA5332MS.

Telit News

Telit LTE IoT Modules Portfolio Adds Global SKUs

Telit, a global enabler of the Internet of Things (IoT), today announced two additional modules based on the Qualcomm 9207 LTE IoT modem, the LE910C1-WWX and LE910C4-WWX, for its LTE IoT portfolio to enable single-SKU global deployments. The new LTE Cat1 and Cat4 modules complete the extensive Telit LE910C1 and LE910C4 families and are the latest examples of Telit’s “design once, use anywhere” philosophy.

iSYSTEM News

iSYSTEM’s BlueBox supports RISC-V

iSYSTEM enhances RISC-V ecosystem with high-performing debug and trace tools.

SK Hynix News

SK hynix Develops PIM, Next-Generation AI Accelerator

It has been generally accepted that memory chips store data and CPU or GPU, like human brain, process data. SK hynix, following its challenge to such notion and efforts to pursue innovation in the next-generation smart memory, has found a breakthrough solution with the development of the latest technology.

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