Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is strengthening its market leadership in power semiconductors by adding significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors.
Class D audio power amplifiers offer a combination of small size, low heat dissipation, high integration, and excellent sound quality. Unlocking the potential of its best-in-class power MOSFET technology, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the MERUS 2-channel, analog input, class D audio amplifier multichip module (MCM) MA5332MS.
Telit, a global enabler of the Internet of Things (IoT), today announced two additional modules based on the Qualcomm 9207 LTE IoT modem, the LE910C1-WWX and LE910C4-WWX, for its LTE IoT portfolio to enable single-SKU global deployments. The new LTE Cat1 and Cat4 modules complete the extensive Telit LE910C1 and LE910C4 families and are the latest examples of Telit’s “design once, use anywhere” philosophy.
e-con Systems, a leading embedded camera company has launched e-CAM81_CUNX, an 8MP (4K) HDR MIPI CSI-2 multi-board camera solution for NVIDIA® Jetson Xavier NX / TX2 NX / Nano development kit.
Arrow Electronics is funding the donation of five prosthetic arms over two years to support the Unlimited Tomorrow Global Initiative’s (UTGI) mission to make prosthetic limbs more accessible to those in need.
It has been generally accepted that memory chips store data and CPU or GPU, like human brain, process data. SK hynix, following its challenge to such notion and efforts to pursue innovation in the next-generation smart memory, has found a breakthrough solution with the development of the latest technology.
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