Weidmüller expands industrial service platform “easyConnect” with a web configurator for PCB plug-in connector OMNIMATE®4.0. Last year, Weidmüller presented the industrial service platform “easyConnect” –which provides universal access to all of the company's digital services. It is far more than just “an account for all of Weidmüller’s digital services”.
NEXCOM, a leading supplier of network appliances, announces a new addition to its well-established cyber security product line with a 1U rackmount - NSA 5190. Besides featuring the latest 12th Gen Intel® Core processor and the highly-anticipated PCIe 4.0 interface, NSA 5190 offers enhanced memory capacity and security.
Silicon Labs, the leader in secure, intelligent wireless technology for a more connected world, today announced a slate of new products that further extend its multiprotocol-supporting, interoperability-driven, and robustly-secure portfolio with new products to advance the innovations and trends shaping the Internet of Things including Matter, Amazon Sidewalk, Wi-SUN, and Wi-Fi 6.
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, has received a new order, worth 955 kUSD (approximately 10 MSEK*) from the first established US Fortune 100 customer.
STMicroelectronics has introduced the L9918 automotive alternator regulator, with enhanced features to ensure the stability of 12V vehicle electrical systems.
Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has launched new ranges of switching test modules that deliver high performance up to 9 kV.
Intel Corporation and Broadcom Inc. showcased the industry’s first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second. The trial used an Intel® Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.
STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST’s ACEPACK1 2 package technology to ensure high power density and simplified assembly.
As artificial intelligence (AI) technology is integrated into massive data centers, the demand for higher performance will continue to increase. Following this trend, high power density and energy-efficient solutions for smart enterprise systems have also become challenging.