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Weidmueller News

Universal customer interface

Weidmüller expands industrial service platform “easyConnect” with a web configurator for PCB plug-in connector OMNIMATE®4.0. Last year, Weidmüller presented the industrial service platform “easyConnect” –which provides universal access to all of the company's digital services. It is far more than just “an account for all of Weidmüller’s digital services”.

Nexcom News

NEXCOM’s New Cyber Security Appliance Boosts Data Transfer Efficiency

NEXCOM, a leading supplier of network appliances, announces a new addition to its well-established cyber security product line with a 1U rackmount - NSA 5190. Besides featuring the latest 12th Gen Intel® Core processor and the highly-anticipated PCIe 4.0 interface, NSA 5190 offers enhanced memory capacity and security.

Silicon Labs News

Silicon Labs Ushers in the Future of IoT at Works With Developer Conference

Silicon Labs, the leader in secure, intelligent wireless technology for a more connected world, today announced a slate of new products that further extend its multiprotocol-supporting, interoperability-driven, and robustly-secure portfolio with new products to advance the innovations and trends shaping the Internet of Things including Matter, Amazon Sidewalk, Wi-SUN, and Wi-Fi 6.

PickeringTest News

Pickering Interfaces introduces 9 kV high voltage PXI and LXI switching modules

Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has launched new ranges of switching test modules that deliver high performance up to 9 kV.

Intel News

Intel and Broadcom Achieve Major Wi-Fi 7 Industry Milestone

Intel Corporation and Broadcom Inc. showcased the industry’s first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second. The trial used an Intel® Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.

ST News

Flexible power modules from STMicroelectronics simplify SiC inverter designs

STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST’s ACEPACK1 2 package technology to ensure high power density and simplified assembly.

Infineon News

Infineon introduces next-generation OptiMOS integrated POL DC-DC regulators with a fast COT engine plus SVID and I²C/PMBus digital interfaces

As artificial intelligence (AI) technology is integrated into massive data centers, the demand for higher performance will continue to increase. Following this trend, high power density and energy-efficient solutions for smart enterprise systems have also become challenging.

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